Photosensitive composition

Abstract

Abstract PURPOSE:To obtain the photosensitive compsn. which can form resist patterns having good sectional shapes by incorporating a polymer and specific photosensitive agent therein. CONSTITUTION:The polymer and the photosensitive agent expressed by formula I are incorporated into this compsn. In formula I, R1 to R4 denote a substd. or unsubstd. alkyl group, arom. ring; X denotes O or N2. The polymer is alkali soluble resins such as polymers contg. an aryl group introduced with an OH group and COOH group in case of applying the photosensitive compsn. to wet development. Light is made to arrive at the part on the substrate side of a resist film in this way at the time of exposing with a KrF excimer laser after a substrate, etc., are coated with this compsn. as the resist film. The resist patterns having the good pattern profiles in which the widths of the front surface and base are nearly equal are obtd. by wet development with an aq. alkaline soln. after exposing.

Inventors

• 👤 Shuji Hayase
• 👤 修二 早瀬
• 👤 Rumiko Horiguchi
• 👤 堀口　留美子
• 👤 Kiyonobu Onishi
• 👤 大西　廉伸
• 👤 Toru Gokochi
• 👤 透 後河内
• 👤 Masataka Miyamura
• 👤 雅隆 宮村
• 👤 Makoto Nakase
• 👤 中瀬　真
• 👤 Shinichi Ito
• 👤 信一 伊藤

Bibliographic Details