Manufacture of integrated circuit

Abstract

Abstract PURPOSE:To make it possible to do manufacturing that the layout design is also easy to various packages by properly cutting a belt-shaped metallic film which was formed along the outsides of a plurality of input/output buffer circuit parts so as to form electrode pads. CONSTITUTION:An integrated circuit 1 is constituted by forming various kinds of elements on a semiconductor substrate: the circuit part 3 of an input/output buffer 2 is formed at a fixed position in the periphery of this integrated circuit 1 regardless of the kind of a package. And, as a preceding process for the process to form an electrode pad, an aluminum film 4 continuing in belt shape is formed at the outside position of this input/output buffer circuit part 3, and this is connected electrically to the input/output buffer circuit part 3, with a wiring pattern 5 for connection. And, according to the position of the lead 6 of a package to be used, the bonding position A of a metallic fine wire to electrically connect the input/output buffer circuit part 3 with the lead 6 is determined, and a cut position C is determined such that it includes this bonding position A and here the aluminum film 4 is cut and separated from each other, and this constitutes an electrode pad.

Inventors

• 👤 Kazuhiko Takamizawa
• 👤 一彦 高見沢

Bibliographic Details