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JPH0247572A Expired / Lapsed JP ⏱️ 0.0 years remaining

Testing jig

Assignee: NTT Inc
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Filing: 1988-08-09
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Granted: —
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Expires: 2008-08-09
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Abstract

Abstract PURPOSE:To perform testing on a high density wiring board with a simple constitution by bringing a printed wiring board for relay wherein the upper and lower electrodes are electrically connected with a wiring pattern into close contact with the testing terminal electrodes of a printed wiring board under test by way of an anisotropic conductive medium. CONSTITUTION:Upper electrodes 13a and lower electrodes 13b are connected with a specified wiring pattern 13c, and a printed wiring board 13 for relay is formed. A first anisotropic conductive medium 14a is provided between the upper surface of the printed wiring board 13 for relay and test terminal electrodes 2a of the printed wiring board 1 under test. A second anisotropic conductive medium 14b is provided between the lower surface and terminals 11a for connecting a testing apparatus. The electric connections are performed only in the vertical direction, respectively. Specified pressure is applied with a compressing means by using a specified driving system in order to obtain the close contact state. In this way, a testing jig which can test the high density printed wiring board can be obtained with a relatively simple constitution.

Inventors

  • 👤 Shigeki Ogawa
  • 👤 茂樹 小川
  • 👤 Chozaburo Minagawa
  • 👤 皆川 長三郎

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 13:10
CPC Classifications
—

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