Hybrid integrated circuit device

Abstract

Abstract PURPOSE:To make a resin seal package compact, and realize a strong resin seal bonding by thinning the plate thickness of a metal heat sink of the part where an hybrid integrated circuit is arranged, and installing a through hole in the thin plate part. CONSTITUTION:The title hybrid integrated circuit device is composed of the following; a hybrid integrated circuit arranged on a metal heat sink 1, a working part 11 having a thin plate thickness H formed by cutting the single face of a side P opposite to the laminated side of the hybrid integrated circuit, a through hole 14 formed in the part 11, and resin 15 sealing the part 11 and the hybrid integrated circuit in a unified body. An insulating Iayers 12 are formed on the front and the rear surfaces of the part 11. A lead frame 7 is engaged with the pad part 131 at a tip end of the resin seal part 11. By this constitution, the resin seal package becomes compact, and further it is facilitated to engage the lead frame with the pad part 131. Since the through hole 14 is formed, resin for sealing is tightly bonded from above and below, via the through hole 14.

Inventors

• 👤 Osamu Fujikawa
• 👤 治 藤川
• 👤 Motoji Kato
• 👤 加藤　基司

Bibliographic Details