Semiconductor device

Abstract

Abstract PURPOSE:To prevent the development of cracks on a mold resin and between the mold resin and a semiconductor element as well by disposing metallic plates where protrusions buried in the mold resin are formed on upper and lower faces that are principal surfaces of the mold resin, thereby bonding the metallic plates to the mold resin in such a way that its mold resin is sandwiched between the foregoing plates. CONSTITUTION:A semiconductor element 13 is bonded with soldering materials and the like onto an upper part of an island 12 which is surrounded by leads 1 and the element 13 is connected electrically with bonding wires 15. After that, when the element is sealed with a mold resin 16, metallic plates 17 are mounted on an upper face part and a lower face part of the mold resin and then, the plates 17 are bonded to the mold resin 16 in such a way that its resin is sandwiched between the foregoing plates. Further, with the use of pressing anchors, anchors 18 are mounted on the metallic plates 17 so that the plates 17 are not detached from the mold resin 16 and the resultant decrease in humidification of the mold resin relieves thermal stress between the mold resin and the semiconductor element. The development of cracks on the mold resin and between the mold resin and the semiconductor element are thus prevented.

Inventors

• 👤 Yoichi Oikawa
• 👤 洋一 及川

Bibliographic Details