Bump for semiconductor device

Abstract

Abstract PURPOSE:To prevent decrease in bump adhesion strength and poor junction by providing a rectangle for the shape of a bump plane so that the bump alinging direction is the short side and the direction perpendicular to the bump aligning direction is the long side. CONSTITUTION:On a semiconductor wafer 1, electronic circuits are formed. Furthermore, an Al electrode part 2 is formed as a pad electrode part. Passivation films 3 represented by a PSG film, a silicon nitride film and the like are formed. On the entire surface of the semiconductor wafer 1, a barrier film 4 of chromium, titanium and like characterized by good adhesion with a ground and a planting conductor film 5 comprising gold and the like characterized by good plating property are sequentially formed. A plated resist layer 6 wherein a hole is provided only at a bump forming part is formed with photoresist. At this time, the hole part in the Al electrode part 2 and the passivation film 3 has a rectangular shape wherein the bump aligning direction is the short side and the direction perpendicular to the bump alining direction is the long side. At the same time, the bump forming part is made to be the same retangular shape as said rectangle. Then, plating for a gold bump is performed to a thickness of 15-30 microns, and a gold bump 7 is formed.

Inventors

• 👤 Kenichi Ogawa
• 👤 健一 小川

Bibliographic Details