Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To integrate light transmitting first and second semiconductor, by hardening a photohardening insulating resin between elements by element- penetrating light by facing opposite contacting electrode surfaces to each other. CONSTITUTION:A semiconductor element 5 for driving having bump electrodes 4 is fixed in the rear and UV-hardening insulating resin 8 is applied to the surface having bump electrodes 6. A CCD element 1 is put on and the electrodes are positioned each other. The CCD element 1 is light-transmitting so that positioning is easy. Both electrodes are made to contact each other by means of a UV-transmitting pressure jig in order to push out insulating resin 8 from among electrodes. Keeping pressure, UV-rays 100 are irradiated from the rear of the element 1 to harden insulating resin 8. After being completely insulated, pressure is removed. The contraction force acts due to hardening of resin 8 so that connection of the electrodes 5 and 6 are maintained even when pressure is removed. By this constitution, a light-receiving element and a luminous element such as a CCD are integrally joined to a semiconductor element for driving so that mounting of a thin type and low cost can be performed.

Inventors

• 👤 Takao Ochi
• 👤 岳雄 越智
• 👤 Kenzo Hatada
• 👤 畑田　賢造
• 👤 Hiroaki Fujimoto
• 👤 博昭 藤本

Bibliographic Details