Nonconductive resin paste composition

Abstract

Abstract PURPOSE:To obtain the title composition which can produce IC, LSI or the like in high productivity, high reliability and low costs by using a specific polybutadiene-modified epoxy resin, a curing agent and an inorganic filler mainly comprising boron fluoride. CONSTITUTION:The subject composition is obtained by using (A) a polybutadiene-modified epoxy resin resulting from reaction of an epoxy resin having 2 or more epoxy groups in one molecule with a butadiene homo-polymer or co-polymer containing 0.01 to 0.5 equivalent of terminal carboxyl groups per 1 equivalent of epoxy group in the epoxy resin, (B) a curing agent such as dicyan-diamide, and (C) an inorganic filler containing more than 20wt.% of boron fluoride.

Inventors

• 👤 Mitsuo Yamazaki
• 👤 山崎　充夫
• 👤 Iwao Maekawa
• 👤 前川　磐雄
• 👤 Yasuo Miyamoto
• 👤 宮本　泰雄

Bibliographic Details