Soldering of double-sided packaging circuit board

Abstract

Abstract PURPOSE:To perform solvent volatilization in the case of preheating from vacancies when reflow-heating is performed by drying creamy solder at the faces of a board after loading components and decreasing the quantity of a volatile matter in solder and then providing the vacancies among solder granules of creamy solder. CONSTITUTION:Each creamy solder 2 is printed on each electrode land 7 on the first faces of a board 1 and each solder 2 is equipped with each component 3A and is heated and dried. In such a case, the surroundings of creamy solder granules in creamy solder are filled with a flux 5 because of solvent volatilization from the inside of creamy solder. After removing a part of its solvent by drying, creamy solder reaches a state that there are a large number of vacancies 6. After the board 1 is reversed, the first and second faces are treated in a lump with reflow-heating and double sided soldering of loaded components is performed. Solvent volatilization is thus performed through a vacancy part and falling and the like due to sudden gasification of a volatile matter is prevented.

Inventors

• 👤 Satoyuki Sato
• 👤 佐藤　聡幸
• 👤 Tadahiko Oaku
• 👤 大阿久　忠彦

Bibliographic Details