Manufacture of composite substrate

Abstract

Abstract PURPOSE:To bond a printed board and a hard board and to eliminate burr, and fold by providing a necessary hole for soldering before laminating adhesive sheets to a printed board and by forming other holes through another process to bond the printed board and a hard board. CONSTITUTION:A cover leg is heat-pressed and fixed temporarily at the edge alone, and then applied to a copper foil 1 through baking process. It is laminated in 4 to 5 layers and a hole 8 is shaped at a position of solder joint. Then 4 to 5 adhesive sheets 6 are laminated and a hole 9 is shaped at a position which requires solder joint later. Several printed boards with sheet 6 are laminated and held between hard boards 11, 11', and then fixed. A fixing hole 12 is shaped with a drill 10. A mold releasing paper 5' under the sheet 6 is removed and the printed board and the hard board 11, 11' are bonded and fixed so that the solder joint hole 8 agrees with an exposed section 3 of the copper foil 11. According to this constitution, production of burr, and fold can be prevented.

Inventors

• 👤 Yukio Sugino
• 👤 杉野　幸男

Bibliographic Details