Vacuum film forming device

Abstract

Abstract PURPOSE:To surely prevent the ambient atmosphere from being introduced into a vacuum chamber by heating water in a cooling water tank with a heater and sending this heated water to a target assembly after sputtering is finished. CONSTITUTION:Cold water is sent to a vacuum chamber 1 during sputtering to cool the circumference of an Al target and the other necessary parts. When sputtering is finished, a cooling device 15 is stopped and a heater 14 is actuated to heat water in a tank 13 to about 60 deg.C or more. The vacuum chamber 1 is opened to perform replacement of the target and successively the vacuum chamber 1 is closed while heated water is allowed to flow and steady evacuating is performed after transitional evacuating. Baking out is performed in the meantime and the impurities in the vacuum chamber 1 are removed. Thereafter the heater 14 is turned off and the cooling device 15 is reactuated. Thereby a thin film excellent in quality can be formed.

Inventors

• 👤 Masaaki Sadamori
• 👤 貞森　將昭
• 👤 Kenji Hajiki
• 👤 健治 枦
• 👤 Hisanori Katamine
• 👤 片峰　寿則

Bibliographic Details