Semiconductor device

Abstract

Abstract PURPOSE:To arrange many bonding pads at high density by a method wherein a first row and a second row where a plurality of bonding pads have been arranged at prescribed intervals and which are mutually parallel are installed and the bonding pads of the second row are arranged in corresponding positions between the bonding pads of the first row. CONSTITUTION:A first row and a second row where a plurality of bonding pads 2A, 2B have been arranged at prescribed intervals and which are mutually parallel are installed; the bonding pads 2B of the second row are arranged in corresponding positions between the bonding pads 2A of the first row. The bonding pads of at least one row out of said bonding pads 2A, 2B are formed as rectangles whose long sides are parallel to edges of a semiconductor pellet. For example, bonding pads are arranged to be row-shaped at a periphery of a semiconductor pellet 1; a plurality of rectangular bonding pads 2B whose long sides are parallel to edges of the semiconductor pellet 1 are arranged to be parallel to a group of bonding pads 2A, arranged in such a manner, of a first row at prescribed intervals between the individual bonding pads of the first row.

Inventors

• 👤 Takumi Matsukura
• 👤 松倉　巧

Bibliographic Details