Screen printing

Abstract

Abstract PURPOSE:To perform positioning with efficiency and accuracy, and to produce only non-defectives, by providing the method for printing solder member on a printed wiring board through a screen with an automatic misregistration compensation driving mechanism A, a warpage detecting mechanism B and a thickness measuring mechanism C. CONSTITUTION:A printed wiring board 1 is sent from a conveyer 5 to the guide rail 2 of a printer system, and the warpage thereof is then detected by the displacement sensor 3 disposed in an X-Y arm 4. When the printed wiring board 1 is a non-defective, it is then set on a positioning table 6. And, the relative misregistration between the patterns 100 and 200 of the board is measured using both a TV camera 7 and a reflecting mirror 16, and correspondingly the table 6 is driven in order to compensate for the misregistration, thereby the alignment between a screen mask 9 and the printed wiring board 1 is automatically performed. Further, a squeegee 10 is so operated as to print solder in past form on the printed wiring board 1 through a screen. Moreover, the printed wiring board 1, which was sent into the guide rail 2, is thereafter detected with the thickness thereof by the other displacement sensor 12 disposed in the other X-Y arm 18. When the board 1 is still a non defective, it is sent to the following process section through a conveyer 14.

Inventors

• 👤 Keiichi Tamura
• 👤 恵一 田村

Bibliographic Details