Resin seal type pin grid array

Abstract

Abstract PURPOSE:To realize temperature characteristics equal to a ceramic substrate type PGA, and to improve the performance of a resin seal type PGA by forming an underside projecting section for bringing a distance with an IC chip near to a heat sink for the resin seal type PGA. CONSTITUTION:An underside projecting section 8a corresponding to the position of an IC chip 1 is shaped on the underside side of a heat sink 8 and a top-face projecting section 8b having a shape larger than said underside projecting section 8a on the top face side, and a stepped section 8c for engagement is formed around the section 8b. Accordingly, adhesion is ensured by filling the upper section of the stepped section 8c for engagement with a sealing resin 6 in the heat sink 8, and the underside projecting section 8a is projected and shaped to the insides of the positions of wire bonding of the IC chip 1, thus transmitting heat generation from the IC chip 1 over the underside projecting section 8a at a short distance and dissipating heat from the top-face projecting section 8b having the large area of heat dissipation.

Inventors

• 👤 Yoshihiro Ishida
• 👤 芳弘 石田
• 👤 Seiichi Mimura
• 👤 三村　精一
• 👤 Katsuji Komatsu
• 👤 小松　勝次
• 👤 Shingo Ichikawa
• 👤 新吾 市川

Bibliographic Details