Imide(meth)acrylate, resin composition produced therefrom and solder resist resin composition

Abstract

Abstract NEW MATERIAL:The imide(meth)acrylate of formula I [R1 is group of formula II, formula III or formula IV; R2 is (CnH2n); R3 is H or CH3; n is 2-6]. USE:Useful as an ultraviolet-curable resin composition, especially a resin composition suitable as a solder resist ink developable with an alkaline aqueous solution and having excellent heat-resistance, adhesivity, chemical resistance and electrical insulation. It can be used also as a dry film, a coating agent for optical fiber, etc. PREPARATION:The compound of formula I can be produced by reacting 1mol of the compound of formula V with about 1-2mol of (meth)acrylic acid in the presence of a polymerization inhibitor. The starting compound of formula V is synthesized by reacting a dicarboxylic acid anhydride such as phthalic anhydride with hydroxyalkylamines.

Inventors

• 👤 Kazumitsu Nawata
• 👤 縄田　一允
• 👤 Tetsuo Okubo
• 👤 大久保　哲男
• 👤 Minoru Yokoshima
• 👤 実 横島

Bibliographic Details