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Card type recording medium and method of manufacturing the same

Assignee: Panasonic Holdings Corp
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Filing: 2001-09-28
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Granted: —
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Expires: 2021-09-28
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Abstract

Abstract Translated from Japanese (57)【要約】 【課題】 メモリ容量を大きくすることができ、かつ、 剛性に優れ、耐衝撃性も良いカード型記録媒体及びその 製造方法を提供する。 【解決手段】 メモリ用基板21,22,70,63, 65に複数のメモリチップ15が実装されて構成される メモリモジュール221,222,270をベース基板 10の一方の面に実装するとともに、上記ベース基板の 他方の面に、上記複数のメモリを動作制御するICチッ プ13,14,60を実装し、全体をパッケージ30, 31内に収納する。 (57) [Summary] [Problem] To increase the memory capacity, and Provided are a card-type recording medium having excellent rigidity and good impact resistance, and a method for manufacturing the same. SOLUTION: Memory substrates 21, 22, 70, 63, The memory modules 221, 222, and 270 configured by mounting the plurality of memory chips 15 on the first substrate 65 are mounted on one surface of the base substrate 10, and the plurality of memories are operation-controlled on the other surface of the base substrate. IC chips 13, 14 and 60 are mounted, and the entire package 30 31.

Inventors

  • 👤 Takahiko Yagi
  • 👤 能彦 八木
  • 👤 Kazuhiro Uji
  • 👤 和博 宇治
  • 👤 Michio Yoshino
  • 👤 道朗 吉野
  • 👤 Kenichi Yamamoto
  • 👤 憲一 山本

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 14:09
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W74/00; H10W74/10; H10W74/15

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