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JP2000357779A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor device and manufacturing method thereof

Assignee: Toshiba Corp
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Filing: 2000-04-05
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Granted: —
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Expires: 2020-04-05
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Abstract

Abstract Translated from Japanese (57)【要約】 【課題】 トレンチ側壁酸化膜の膜厚をほぼ均一とする こと。 【解決手段】 本発明にかかる半導体装置の製造方法 は、トレンチ形成後に熱工程を経ることによりトレンチ をほぼ八面体とし、熱酸化膜を形成することにより酸化 膜の膜厚をほぼ一定とできる。 [PROBLEMS] To make the thickness of a trench sidewall oxide film substantially uniform. A method of manufacturing a semiconductor device according to the present invention can make a trench substantially octahedral by performing a thermal process after forming a trench, and can make a thickness of an oxide film substantially constant by forming a thermal oxide film.

Inventors

  • 👤 Takashi Kito
  • 👤 傑 鬼頭
  • 👤 Tsutomu Sato
  • 👤 力 佐藤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-27 15:52
CPC Classifications
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