JP2000357779A
Expired / Lapsed
JP
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Semiconductor device and manufacturing method thereof
Assignee: Toshiba Corp
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Filing: 2000-04-05
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Granted: —
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Expires: 2020-04-05
Abstract
Abstract Translated from Japanese (57)【要約】 【課題】 トレンチ側壁酸化膜の膜厚をほぼ均一とする こと。 【解決手段】 本発明にかかる半導体装置の製造方法 は、トレンチ形成後に熱工程を経ることによりトレンチ をほぼ八面体とし、熱酸化膜を形成することにより酸化 膜の膜厚をほぼ一定とできる。 [PROBLEMS] To make the thickness of a trench sidewall oxide film substantially uniform. A method of manufacturing a semiconductor device according to the present invention can make a trench substantially octahedral by performing a thermal process after forming a trench, and can make a thickness of an oxide film substantially constant by forming a thermal oxide film.
Inventors
- 👤 Takashi Kito
- 👤 傑 鬼頭
- 👤 Tsutomu Sato
- 👤 力 佐藤
Bibliographic Details
Application Number
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Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-27 14:43
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