Method and device for cooling electronic components and assemblies or subassemblies of electronic components

Abstract

Abstract The device comprises: a tubular sleeve 2 arranged around the electronic element 1 to be cooled which is placed in an enclosure 7, this sleeve allowing, between the external surface of the element and the internal surface of the sleeve, an annular passage 3 for the circulation of a cooling gas; a conduit 6 comprising an upper end 16 and a lower end 17 outside the enclosure, the upper end communicating with the said passage, whereas the lower end communicates with a space outside the enclosure containing fresh gas; and at least one orifice 8 provided in the upper part 9 of the enclosure.

Inventors

• 👤 Jean-Louis Paul Quilhot
• 👤 Paul Andre Marie Perrier

Bibliographic Details