US4449164A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic module cooling system using parallel air streams
Assignee: Control Data Corp
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Filing: 1982-09-27
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Granted: 1984-05-15
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Expires: 2002-09-27
Abstract
Abstract The cooling of electronic modules on a circuit board is improved by the use of heat sinks comprising a plurality of longitudinal fins projecting from the modules. Individual tubes communicating with an air plenum fit around and part way along each heat sink. Air drawn from or forced into the plenum causes air flow within the tubes and along the fins to cool them and the modules to which they are attached.
Inventors
- 👤 Douglas M. Carlson
- 👤 Randall L. Ohman
- 👤 Lloyd M. Thorndyke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 00:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
153 words
In an assembly comprising a base, a circuit board mounted thereon, and a plurality of heat-generating electronic modules mounted on a side of the circuit board, an improved means for cooling the modules, comprising (a) a plurality of heat conductive heat sinks each comprising a plurality of fins projecting from the circuit board, each heat sink attached in intimate thermal contact at one end to an electronic module; (b) an air plenum mounted on the base having an air guiding side in facing, spaced apart relation with the side of the circuit board on which the heat sinks are mounted, said air guiding side including a plurality of tube sections communicating with the plenum's interior, each extending toward and partially enclosing a heat sink, the exterior of each tube section being substantially sealed to the air guiding side; and (c) means for creating an air pressure in the plenum different from the ambient.
Claim 2
Dependent Claim
153 words
In an assembly comprising a base, a circuit board mounted thereon, and a plurality of heat-generating electronic modules mounted on a side of the circuit board, an improved means for cooling the modules, comprising (a) a plurality of heat conductive heat sinks each comprising a plurality of fins projecting from the circuit board, each heat sink attached in intimate thermal contact at one end to an electronic module; (b) an air plenum mounted on the base having an air guiding side in facing, spaced apart relation with the side of the circuit board on which the heat sinks are mounted, said air guiding side including a plurality of tube sections communicating with the plenum's interior, each extending toward and partially enclosing a heat sink, the exterior of each tube section being substantially sealed to the air guiding side; and (c) means for creating an air pressure in the plenum different from the ambient.
Claim 3
Dependent Claim
20 words
The assembly of claim 1, wherein a heat sink comprises a plurality of fins projecting axially from a central stem.
Claim 4
Dependent Claim
20 words
The improvement of claim 1, wherein each heat sink is shaped to closely fit within the tube sections enclosing it.
Claim 5
Dependent Claim
63 words
The improvement of claim 1, wherein each tube section encloses a fraction of the heat sink creating an open circumferential area at the base of the heat sink at least equal to the internal cross sectional area of the tube section less the solid cross sectional area of the heat sink, both said cross sections being taken perpendicular to the tube section's axis.
Claim 6
Dependent Claim
35 words
The improvement of claim 1, wherein each tube section encloses at least about 1/10th of the length of the associated heat sink, and the air pressure difference creating means creates positive pressure within the plenum.
Claim 7
Dependent Claim
16 words
The improvement of claim 1, wherein the tube sections are integral with the air guiding side.
Claim 8
Dependent Claim
14 words
The improvement of claim 1, wherein each heat sink comprises high heat conductive metal.
Claim 9
Dependent Claim
17 words
The improvement of claim 5, wherein each heat sink closely fits within the tube section enclosing it.
Claim 10
Dependent Claim
64 words
The improvement of claim 8, wherein each tube section encloses the amount of the heat sink which creates an open circumferential area at the base of the heat sink at least equal to the internal cross sectional area of the tube section less the solid cross sectional area of the heat sink, both said cross sections being taken perpendicular to the tube section's axis.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-15 | 1987-11-14 | 1988-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-15 | 1991-11-14 | 1992-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-15 | 1995-11-14 | 1996-05-15 | $7700.00 | Window Closed / Lapsed |