Patent EP1434426A2 successfully refreshed from Google Patents.
EP1434426A2
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Camera module and manufacturing method thereof
Assignee: Sanyo Electric Co Ltd
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Filing: 2003-12-18
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Granted: —
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Expires: 2023-12-18
Abstract
Abstract A camera module for a mobile device is reduced in size and production cost. A lens (10) being essentially same in size as an image sensor chip (20) is bonded to a surface of the image sensor chip (20). An IR filter (30) is bonded to the lens and an iris material is provided onto the IR filter (31). Bump electrodes (25A, B) formed on a back surface of the image sensor chip (20) are connected to a printed circuit board.
Inventors
- 👤 Osamu Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 02:45
CPC Classifications
H; H04; H04N; H04N23/00; H04N23/50; H04N23/54; H04N23/55; H10; H10F; H10F39/00; H10F39/80; H10F39/804; H10F39/806; H10F77/00; H10F77/40; H10F77/407; H10F77/413; H10F77/50
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
79 words
A camera module comprising: an image sensor chip (20) comprising a semiconductor
chip (21) having a photoelectronic
transducer formed on a first portion of a front
surface of the semiconductor chip (21) and having
an electrode pad (23A, B) formed on a second
portion of the front surface and connected
to a terminal (25A, B) for external connection
disposed on a back surface of the semiconductor
chip (21); and a lens (10) bonded to the image sensor chip
(20).
Claim 2
Dependent Claim
28 words
The camera module of claim 1, wherein the image sensor
ship (20) and the lens (10) substantially have a
same size with respect to a primary plane thereof.
Claim 3
Dependent Claim
27 words
The camera module of claim 1 or 2, further comprising
a filter (30) to block light incident on the lens
(10) at a predetermined range of wavelength.
Claim 4
Dependent Claim
26 words
The camera module of claim 3, further comprising an
iris portion (31) disposed on the filter (30) so as
to provide an aperture for the light.
Claim 5
Dependent Claim
24 words
The camera module of claim 1 or 2, further comprising
a filter (30) disposed between the image sensor chip
(20) and the lens (10).
Claim 6
Dependent Claim
26 words
The camera module of claim 5, further comprising an
iris portion (31) disposed on the lens (10) so as to
provide an aperture for the light.
Claim 7
Dependent Claim
28 words
The camera module according to any of claims 1 to 6,
further comprising another lens (40) disposed above
the lens (10) bonded to the image sensor chip (20).
Claim 8
Dependent Claim
32 words
The camera module of claim 7, further comprising a
positioning portion (43) positioning said another
lens (40) at a predetermined distance from the lens
(10) bonded to the image sensor chip (20).
Claim 9
Independent Claim
115 words
A method of manufacturing a camera module comprising: providing an image sensor wafer (100) comprising
a plurality of image sensor chips (20),
each of the image sensor chips comprising a
photoelectronic transducer and a terminal for
external connection; providing a lens array (101) comprising a plurality
of lenses (10), each of the lenses (10)
being configured to cover a corresponding image
sensor chip (20); bonding the lens array (101) to a surface of
the image sensor wafer (100) to form a bonded
assembly; and dividing the bonded assembly into individual
camera modules (200) so that each of the camera
modules (200) comprises one of the image sensor
chips (20) and one of the lenses (10).
Claim 10
Dependent Claim
29 words
The method of claim 9, wherein a primary surface of
the lens array (101) and a primary surface of the image
sensor wafer (100) have substantially a same
size.
Claim 11
Dependent Claim
16 words
The method of claim 9, wherein the lens array (101)
comprises a plurality of sub arrays.
Claim 12
Dependent Claim
17 words
The method of claim 9, wherein the lens array (101)
comprises a plurality of rectangular sub arrays.
Claim 13
Independent Claim
128 words
A method of manufacturing a camera module comprising: providing an image sensor wafer (100) comprising
a plurality of image sensor chips (20),
each of the image sensor chips comprising a
photoelectronic transducer and a terminal for
external connection; providing a lens array (101) comprising a plurality
of lenses (10), each of the lenses being
configured to cover a corresponding image sensor
chip (20); providing a filter (102) and an iris portion
(103); bonding the image sensor wafer (100), the lens
array (101), the filter (102) and the iris portion
(103) together to form a bonded assembly;
and dividing the bonded assembly into individual
camera modules (200) so that each of the camera
modules (200) comprises one of the image sensor
chips (20) and one of the lenses (10).
Claim 14
Independent Claim
128 words
A method of manufacturing a camera module comprising: providing an image sensor wafer (100) comprising
a plurality of image sensor chips (20),
each of the image sensor chips (20) comprising
a photoelectronic transducer and a terminal for
external connection; providing a lens array (101) comprising a plurality
of lenses (10), each of the lenses (10)
being configured to cover a corresponding image
sensor chip (20); bonding the lens array (101) to a surface of
the image sensor wafer (100) to form a bonded
assembly; mounting an additional lens (40) over each of
the lens (10); and dividing the bonded assembly into individual
camera modules (200) so that each of the camera
modules (200) comprises one of the image sensor
chips (20) and one of the lenses (10, 40).
Claim 15
Dependent Claim
30 words
The method of claim 14, wherein the additional lens
(40) is mounted on the lens array (101) after the
lens array (101) is bonded to the image sensor wafer
(100).
Claim 16
Dependent Claim
26 words
The method of claim 14, wherein the additional lens
(40) is mounted on each of the individual camera modules
(200) that are separated from each other.
Claim 17
Dependent Claim
56 words
A camera module comprising: an image sensor chip (20) comprising a photoelectronic
transducer; and a lens (10) bonded to the image sensor chip
(20), the lens (10) comprising a lens body (11)
and a lens frame (12), wherein a surface of the lens frame (12) is configure
to serve as a barrel of the camera module.
References Cited (Backward Citations)
No citation records indexed.
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