Patent EP0884781A2 successfully refreshed from Google Patents.
EP0884781A2
Expired / Lapsed
EP
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Power semiconductor module
Assignee: Hitachi Ltd
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Filing: 1998-06-05
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Granted: —
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Expires: 2018-06-05
Abstract
Abstract A power semiconductor module comprises a metal base, plural wiring substrates provided on said the base, a first wiring substrate of the wiring substrates having a power circuit portion including a power semiconductor device, and a substrate containing portions having a resin portion in which one of the wiring substrstes is contained. The one of the wiring substrates is positioned in self-alignment on the metal substrate on the basis of an inner wall of the resin portion of the substrate containing portion.
Inventors
- 👤 Yukio Sonobe
- 👤 Akihiro Tanba
- 👤 Kazuji Yamada
- 👤 Ryuichi Saito
- 👤 Masataka Sasaki
- 👤 Tatsuya Shigemura
- 👤 Kazuhiro Suzuki
- 👤 Shigeki Sekine
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 09:27
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W72/551; H10W72/552; H10W90/701; H10W90/751; H10W90/753
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
82 words
A power semiconductor module comprising: a metal base; plural wiring substrates provided on said metal base,
a first wiring substrate of the wiring substrates having a
power circuit including a power semiconductor device; a substrate containing portions having a resin
portion in which one of said wiring substrstes is contained,
and wherein said one of said wiring substrates is
positioned in self-alignment on said metal substrate on the
basis of an inner wall of said resin portion of the
substrate containing portion.
Claim 2
Dependent Claim
26 words
A power semiconductor module according to claim 1,
wherein a second wiring substrate of the wiring substrates
has a control circuit for controlling the power circuit.
Claim 3
Dependent Claim
29 words
A power semiconductor module according to claim 2,
wherein a third wiring substrate of the wiring substrates
has terminals for electrically connecting the power circuit
to the control circuit.
Claim 4
Dependent Claim
21 words
A power semiconductor module according to claim 3,
wherein the third wiring substrate is arraged on one side
of the module.
Claim 5
Dependent Claim
45 words
A power semiconductor module according to claim 1,
wherein a minimum value of a gap between at least two sides
of said one of the wiring substrates and said resin portion
of the substrate containing portion is in a range of 1.1 mm
or less.
Claim 6
Dependent Claim
57 words
A power semiconductor module according to claim 1,
wherein the resin portion of the substrate containing
portion is formed with a step for allowing the wiring
substrates to be contained in the substrate containing
portion in such a manner as to be deviated from each other,
and the step is used for positioning between the wiring
substrates.
Claim 7
Dependent Claim
28 words
A power semiconductor module according to claim 1,
wherein the resin porton of the substrate containing
portion has a projection for positioning said one of the
wiring substrates.
Claim 8
Dependent Claim
24 words
A power semiconductor module according to claim 1,
wherein said one of the substrates has a projection for
positioning said one of the substrates.
Claim 9
Dependent Claim
30 words
A power semiconductor module according to claim 3,
wherein the terminals are arranged in a line with a
specific pitch and are fixed with a resin to form
connection terminals.
Claim 10
Dependent Claim
45 words
A power semiconductor module according to claim 1,
further comprising an input/output control terminal of the
module, wherein a second wiring substrate of the wiring
substrates has a bonding pad for a connection between said
one of th wiring substrates and said input/output control
terminal.
Claim 11
Dependent Claim
49 words
A power semiconductor module according to claim 2,
further comprising an input/output control terminal of the
module, wherein the second wiring substrate has bonding
pads for both of a connection between the powercircuit and
the control circuit and a connection between the control
circuit and the input/output control terminal.
Claim 12
Dependent Claim
44 words
A power semiconductor module according to claim 2,
further comprising a resin layer integrated with the resin
portion provided on the ground of the wiring substrate
containing portion, wherein the second wiring substrate is
electrically insulated to the metal base by the resin layer.
References Cited (Backward Citations)
No citation records indexed.
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