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EP0851473A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of making a layer with high dielectric K, gate and capacitor insulator layer and device

Assignee: Nokia of America Corp
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Filing: 1997-12-23
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Granted: —
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Expires: 2017-12-23
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Abstract

Abstract A method of making a gate or capacitor insulator structure using a first grown oxide layer (3), depositing a high-k dielectric material (4) on the grown oxide layer, and then depositing an oxide layer (5). The deposited oxide layer is then desirably densified in an oxidizing atmosphere. A conductive layer (6), such as a gate or capacitor plate, may be then formed on the deposited oxide layer. The resulting structure has a first grown oxide layer (3), a high-k dielectric material (4) on the grown oxide layer, and a deposited oxide layer (5) on the high-k dielectric oxide layer. Conductive layer (6) on the deposited oxide layer may be used as a gate or a capacitor plate. <IMAGE>

Inventors

  • 👤 Isik C. Kizilyalli
  • 👤 Pradip Kumar Roy
  • 👤 Yi Ma

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 01:10
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/684

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 56 words
A method of making an integrated circuit having an oxidizable layer (2) with a surface, including the step of: growing an oxide layer (3) on the oxidizable surface; and characterized by the steps of depositing a high-k dielectric layer (4) on the grown oxide layer; and depositing an oxide layer (5) on the high-k dielectric layer.
Claim 2
Dependent Claim 20 words
The method as recited in claim 1, further comprising the step of: densifying the deposited oxide in an oxidizing atmosphere.
Claim 3
Dependent Claim 29 words
The method as recited in claim 2, wherein the high-k dielectric layer is selected from the group of Ta 2 O 5 , TiO 2 , and perovskite materials.
Claim 4
Dependent Claim 41 words
The method as recited in claim 2, wherein the perovskite material is of the form MTiO 3 , where M is selected from the group of Sr, Ba, La, Ti, Pb, Ba x Sr 1-x and Pb x La 1-x .
Claim 5
Dependent Claim 23 words
The method as recited in claim 2, wherein the oxide layers are oxides of silicon, and the oxidizable layer is a silicon substrate.
Claim 6
Dependent Claim 21 words
The method as recited in claim 5, further comprising the step of depositing a conductive layer on the deposited oxide layer.
Claim 7
Dependent Claim 44 words
An integrated circuit having an oxidizable layer (2) with a surface having a grown oxide layer (3) on the oxidizable surface; characterized by a high-k dielectric layer (4) on the grown oxide layer; and a deposited oxide layer (5) on the high-k dielectric layer.
Claim 8
Dependent Claim 19 words
The integrated circuit as recited in claim 7, wherein the deposited oxide layer is a densified deposited oxide layer.
Claim 9
Dependent Claim 30 words
The integrated circuit as recited in claim 8, wherein the high-k dielectric layer is selected from the group of Ta 2 O 5 , TiO 2 , and perovskite materials.
Claim 10
Dependent Claim 42 words
The integrated circuit as recited in claim 8, wherein the perovskite material is of the form MTiO 3 , where M is selected from the group of Sr, Ba, La, Ti, Pb, Ba x Sr 1-x and Pb x La 1-x .
Claim 11
Dependent Claim 24 words
The integrated circuit as recited in claim 8, wherein the oxide layers are oxides of silicon, and the oxidizable layer is a silicon substrate.

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