Patent EP0804061A1 successfully refreshed from Google Patents.
EP0804061A1
Expired / Lapsed
EP
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Multilayered printed wiring board and its manufacture
Assignee: Ibiden Co Ltd
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Filing: 1996-03-29
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Granted: —
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Expires: 2016-03-29
Abstract
Abstract It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an insulating layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
Inventors
- 👤 Toshihiko Yasue
- 👤 Yasuji Hiramatsu
- 👤 Hideki Yano
- 👤 Yoshifumi Ishitani
- 👤 Yoichiro Kawamura
- 👤 Hideki Murase
- 👤 Ayumi Suzuki
- 👤 Masato Kawade
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 10:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4661; H05K3/0094; H05K3/4602; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0183; H05K2201/0195; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0212; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/0959; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K3/38; H05K3/382; H05K3/384
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
79 words
A multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, characterized in that said resin insulating layer is comprised of a composite layer consisting of an insulating layer made from a heat-resistant resin hardly soluble in acid or an oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer.
Claim 2
Dependent Claim
17 words
A multilayer printed circuit board according to claim 1, wherein the insulating layer contains a thermoplastic resin.
Claim 3
Dependent Claim
30 words
A multilayer printed circuit board according to claim 1, wherein the insulating layer is a heat-resistant resin containing an organic resin filler hardly soluble in the acid or oxidizing agent.
Claim 4
Dependent Claim
46 words
A multilayer printed circuit board according to claim 1, wherein the adhesive layer is an adhesive formed by dispersing particles of a heat-resistant resin soluble in the acid or oxidizing agent into a matrix of a heat-resistant resin hardly soluble in the acid or oxidizing agent.
Claim 5
Dependent Claim
29 words
A multilayer printed circuit board according to claim 1, wherein the adhesive layer has a thickness of 10-50 µm and the insulating layer has a thickness of 10-100 µm.
Claim 6
Dependent Claim
65 words
A multilayer printed circuit board according to claim 3, wherein the organic resin filler is particles of a heat-resistant resin hardly soluble in the acid or oxidizing agent and has a maximum particle size corresponding to not more than 8/10 of the thickness of the insulating layer and an average particle size corresponding to not more than 1/2 of the thickness of the insulating layer.
Claim 7
Dependent Claim
32 words
A multilayer printed circuit board according to claim 3, wherein the filling amount of the organic resin filler is 10-100 parts by volume per 100 parts by volume of the heat-resistant resin.
Claim 8
Dependent Claim
38 words
A multilayer printed circuit board according to claim 3, wherein the organic resin filler is made from at least one resin selected from the group consisting of epoxy resin, benzoguanamine resin, styrene resin, divinylbenzene resin and polyimide resin.
Claim 9
Dependent Claim
41 words
A multilayer printed circuit board according to claim 1, wherein particles of a heat-resistant resin soluble in the acid or oxidizing agent and having an average particle size of 0.1-0.6 µm are dispersed into the insulating layer as the lower layer.
Claim 10
Dependent Claim
88 words
A multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, characterized in that said lower conductor circuit layer is formed by etching a substrate provided with a conductor layer to remove a conductor useless portion therefrom, and a resin is filled in a concave portion formed by removing the conductor useless portion so that the surface of the resin is same as the surface of the lower conductor circuit layer.
Claim 11
Dependent Claim
31 words
A multilayer printed circuit board according to claim 10, wherein the resin filled in the concave portion formed by removing the conductor useless portion is a cured product of non-solvent resin.
Claim 12
Dependent Claim
28 words
A multilayer printed circuit board according to claim 10, wherein the resin filled in the concave portion formed by removing the conductor useless portion contains a ceramic filler.
Claim 13
Dependent Claim
158 words
A multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, characterized in that said lower conductor circuit layer is formed by etching a substrate provided with a conductor layer to remove a conductor useless portion therefrom, and a resin is filled in a concave portion formed by removing the conductor useless portion so that the surface of the resin is same as the surface of the lower conductor circuit layer, and said resin insulating layer is comprised of a composite layer consisting of an insulating layer made from a heat-resistant resin hardly soluble in acid or an oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and said upper conductor circuit layer is formed on said adhesive layer constituting the upper layer of said resin insulating layer.
Claim 14
Dependent Claim
31 words
A multilayer printed circuit board according to claim 13, wherein the resin filled in the concave portion formed by removing the conductor useless portion is a cured product of non-solvent resin.
Claim 15
Dependent Claim
28 words
A multilayer printed circuit board according to claim 13, wherein the resin filled in the concave portion formed by removing the conductor useless portion contains a ceramic filler.
Claim 16
Dependent Claim
49 words
A multilayer printed circuit board according to claim 13, wherein particles of a heat-resistant resin soluble in the acid or oxidizing agent and having an average particle size of 0.1-0.6 µm are dispersed in the insulating layer made from the heat-resistant resin hardly soluble in acid or oxidizing agent.
Claim 17
Independent Claim
136 words
A method of producing a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, which comprises the following steps (a) - (e): (a) a step of forming said lower conductor circuit layer by etching a substrate provided with a conductor layer to remove a conductor useless portion therefrom; (b) a step of applying a resin to the substrate having a concave portion formed by removing the conductor useless portion and then curing the resin; (c) a step of polishing the cured resin of the step (b) till the lower conductor circuit layer is exposed; (d) a step of forming said resin insulating layer; (e) a step of forming said upper conductor circuit layer on said resin insulating layer.
Claim 18
Dependent Claim
65 words
A method of producing a multilayer printed circuit board according to claim 17, wherein said resin insulating layer formed in the step (d) is a composite layer consisting of an insulating layer made from a heat-resistant resin hardly soluble in acid or an oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer.
Claim 19
Dependent Claim
53 words
A method of producing a multilayer printed circuit board according to claim 18, wherein particles of a heat-resistant resin soluble in the acid or oxidizing agent and having an average particle size of 0.1-0.6 µm are dispersed in the insulating layer made from the heat-resistant resin hardly soluble in acid or oxidizing agent.
References Cited (Backward Citations)
No citation records indexed.
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