Process for bonding wires to oxidation-sensitive metal substrates which can be soldered

Abstract

Abstract In order to bond unhoused semiconductor circuits (chips) electroconductively on circuit boards, the surfaces of the copper structures are generally coated with a nickel layer which is then coated with a layer of gold in order to be able to produce wire connections between the circuit and the conductive structures on the circuit board. The connection between the wire and the connection sites on the circuit, on the one hand, and the conductive structures on the circuit board, on the other, is formed by pressure welding, in particular ultrasound bonding. A novel process by means of which organic protective layers are deposited on the copper surfaces on the circuit board prevents the formation of oxide layers and other impurities on the copper surfaces and thus permits direct connection of the wire by ultrasound bonding to the copper surfaces without impairing the ability of the surfaces to be soldered.

Inventors

• 👤 Heinrich Meyer
• 👤 Frank Rudolf

Bibliographic Details