Patent EP0782191A2 successfully refreshed from Google Patents.
EP0782191A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multi-level stacked integrated-circuit-chip assembly
Assignee: Nokia of America Corp
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Filing: 1996-12-10
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Granted: —
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Expires: 2016-12-10
Abstract
Abstract A multi-level stack of integrated circuit has alternating chips and flip-chips, together with wirebonds that interconnect wiring pads (I/O pads) of the chips located on differing levels of the stack. In addition, solder bumps located between chips and flip-chips located in vertically adjacent levels interconnect the wiring pads of these chips with the wiring pads of these flip-chips.
Inventors
- 👤 Yinon Degani
- 👤 Byung Joon Han
- 👤 Thomas Dixon Dudderar
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:46
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
100 words
A multi-level stacked integrated-circuit-chip assembly comprises: (a) a first device comprising a wiring substrate or a first integrated circuit chip, a top major surface of the first device having at least a first wiring pad; (b) second and third devices each comprising an integrated circuit chip or a wiring substrate, the third device located overlying the second device, the second device overlying the first device, a bottom major surface of the second device having integrated circuitry thereat and at least a third wiring pad; and, (c) a wirebond directly electrically connecting the third wiring pad with the first wiring pad.
Claim 2
Dependent Claim
31 words
The assembly of claim 1 or 8, in which the top major surface of the third device and the bottom major surface of the second device have substantially identical lateral dimensions.
Claim 3
Dependent Claim
32 words
The assembly of claim 1 or 2, further comprising an adhesive bonding layer that bonds a bottom major surface of the third device with a top major surface of the second device.
Claim 4
Dependent Claim
33 words
The assembly of claim 1 or 3, further comprising a first solder bump directly connecting the second wiring pad with a third wiring pad located on the top surface of the first device.
Claim 5
Dependent Claim
95 words
The assembly of claim 4 further comprising a fourth and fifth devices each of which comprises an integrated circuit chip or wiring substrate, the fifth device overlying the fourth device, the fourth device overlying the third device, the fourth device having at least a fourth wiring pad located at a bottom major surface thereof, the fifth device having at least a fifth wiring pad located at a top major surface thereof, (a) a second wirebond directly connecting the fifth wiring pad with a sixth wiring pad located on the top surface of the first device.
Claim 6
Dependent Claim
78 words
The assembly of claim 1 further comprising fourth and fifth devices each of which comprises an integrated circuit chip or a wiring substrate, the fifth device overlying the fourth device, the fourth device overlying the third device, the fourth device having at least a fourth wiring pad located at a top major surface thereof, (a) a second wirebond directly connecting the fifth wiring pad with a sixth wiring pad located on the top surface of the first device.
Claim 7
Dependent Claim
57 words
The assembly of claim 6 further comprising; (a) a first solder bump directly connecting the second wiring pad with a third wiring pad located on the top surface of the first device and a second solder bump directly connecting the fourth wiring pad with a seventh wiring pad located on the top surface of the third device.
Claim 8
Dependent Claim
30 words
The assembly of claim 7 further comprising an adhesive bonding layer that bonds a bottom major surface of the fifth device with a top major surface of the fourth device.
Claim 9
Dependent Claim
31 words
The assembly of claim 8 further comprising a second solder bump directly connecting the fourth wiring pad with a seventh wiring pad located on the top surface of the third device.
Claim 10
Dependent Claim
39 words
The assembly of claim 7 further comprising a third wirebond directly connecting an eighth wiring pad located on the top surface of the fifth device with a ninth wiring pad located on the top surface of the third device.
Claim 11
Dependent Claim
30 words
The assembly of claim 8 further comprising second adhesive bonding layer that bonds a bottom major surface of the fifth device with a top major surface of the fourth device.
Claim 12
Dependent Claim
29 words
The assembly of claim 7 in which the top major surface of the fourth device and the bottom major surface of the fifth device have substantially identical lateral dimensions.
References Cited (Backward Citations)
No citation records indexed.
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