Patent EP0747167A2 successfully refreshed from Google Patents.
EP0747167A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus for holding a substrate during polishing
Assignee: Applied Materials Inc
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Filing: 1996-06-05
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Granted: —
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Expires: 2016-06-05
Abstract
Abstract A wafer polishing head (100) utilises a wafer backing member (124) having a wafer facing pocket (126) which is sealed against the wafer and is pressurised with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature (123) at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad (182). Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature (123) of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows (118) supports and presses the wafer backing member (124) toward the polishing pad (182) and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad. An integral, but independently retractable and extendable retaining ring assembly (146) is provided around the wafer backing member and wafer to uniformly an independently control the pressure of a wafer perimeter retaining ring (162) on the polishing pad (182) of a wafer polishing bed (180).
Inventors
- 👤 Norm Shendon
- 👤 Michael Sherwood
- 👤 Henry Lee
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 07:06
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B37/27; B24B37/30; B24B37/32
Claims Analysis
Total Claims: 46
Claim 1
Independent Claim
75 words
An apparatus for holding a substrate during polishing comprising: a polishing head substrate backing member having a substrate facing side, said substrate facing side including a seal to generally fluid tightly seal the member to the perimeter of the substrate being polished, said member including a fluid supply passage therethrough opening to the confines of a pocket formed between the substrate and said substrate facing side of the member within the boundary of said seal.
Claim 2
Dependent Claim
87 words
An apparatus for holding a substrate during polishing as in Claim 1, wherein said seal is an elastomeric material such that when said seal is pressed against the substrate during polishing of the substrate, thereby pressing the substrate to a polishing pad, the contact between the substrate facing side including said seal and the perimeter of said substrate when the head is rotated provides a frictional force between said substrate facing side and the perimeter of the substrate so that said substrate generally turns with said head.
Claim 3
Dependent Claim
33 words
An apparatus for holding a substrate during polishing as in Claim 1, wherein said polishing head substrate backing member is supported from a polishing head housing support member through a pressure containing bellows.
Claim 4
Dependent Claim
33 words
An apparatus for holding a substrate during polishing as in Claim 2, wherein said polishing head substrate backing member is supported from a polishing head housing support member through a pressure containing bellows.
Claim 5
Independent Claim
183 words
An apparatus for holding a substrate during polishing comprising: a polishing head substrate backing member supported from a polishing head housing support member; a substrate retaining ring assembly surrounding said substrate backing member, said ring assembly being separate from and movable relative to said substrate backing member and separate from and movable relative to said housing support member; wherein said housing support member is connected to said retaining ring assembly by a first set of one or more elastic members which elastically urge the retaining ring assembly to retract away from a polishing face of said polishing head substrate backing member; wherein said housing support member is connected to said retaining ring assembly by a second set of one or more elastic members which elastically urge the retaining ring assembly to extend towards the polishing face of said polishing head substrate backing member; wherein either said first set or said second set of elastic members is configured to increase or to decrease a magnitude of the force associated with the elastic urge between said housing support member and said retaining ring assembly thereof.
Claim 6
Dependent Claim
35 words
An apparatus for holding a substrate during polishing as in Claim 5, wherein said first set of one or more elastic members is a set of springs generally equally distributed around said substrate backing member.
Claim 7
Dependent Claim
76 words
An apparatus for holding a substrate during polishing as in Claim 5, wherein said second set of one or more elastic members is an annular bladder around said substrate backing member, wherein said bladder is pressurized to increase the magnitude of the force associated with the elastic urge between said housing support member and said retaining ring assembly causing the retaining ring assembly to extend towards the polishing face of said polishing head substrate backing member.
Claim 8
Dependent Claim
188 words
An apparatus for holding a substrate during polishing as in Claim 1, further comprising: the polishing head substrate backing member supported from a polishing head housing support member; a substrate retaining ring assembly surrounding said substrate backing member, said ring assembly being separate from and movable relative to said substrate backing member and separate from and movable relative to said housing support member; wherein said housing support member is connected to said retaining ring assembly by a first set of one or more elastic members which elastically urge the retaining ring assembly to retract away from a polishing face of said polishing head substrate backing member; wherein said housing support member is connected to said retaining ring assembly by a second set of one or more elastic members which elastically urge the retaining ring assembly to extend towards the polishing face of said polishing head substrate backing member; wherein either said first set or said second set of elastic members is configured to increase or to decrease a magnitude of the force associated with the elastic urge between said housing support member and said retaining ring assembly thereof.
Claim 9
Dependent Claim
35 words
An apparatus for holding a substrate during polishing as in Claim 8, wherein said first set of one or more elastic members is a set of springs generally equally distributed around said substrate backing member.
Claim 10
Dependent Claim
76 words
An apparatus for holding a substrate during polishing as in Claim 8, wherein said second set of one or more elastic members is an annular bladder around said substrate backing member, wherein said bladder is pressurized to increase the magnitude of the force associated with the elastic urge between said housing support member and said retaining ring assembly causing the retaining ring assembly to extend towards the polishing face of said polishing head substrate backing member.
Claim 11
Independent Claim
73 words
An apparatus for holding a substrate during polishing comprising: a polishing head substrate backing member including a pressurizable pocket open to and facing a back surface of the substrate to be polished, a perimeter of said pocket being sealable to the back of said substrate, the pocket including an opening therein for controlling the pressure within the pocket by the use of fluid passing into and out of said pocket through said opening.
Claim 12
Dependent Claim
93 words
An apparatus for holding a substrate during polishing as in Claim 11, further comprising a bellows member, wherein said polishing head substrate backing member is supported from a polishing head housing support member through the bellows member which in use provides a generally uniform force pressing the polishing head backing member toward a polishing pad generally irrespective of changes in the distance between the polishing head housing support member and the polishing pad as the polishing head pressing the substrate to be polished toward the polishing pad moves relative to the polishing pad.
Claim 13
Dependent Claim
216 words
An apparatus for holding a substrate during polishing as in Claim 11, further comprising a floating substrate retaining ring member assembly configured in use to generally surround said substrate to be polished to prevent the substrate, being pressed toward said polishing pad by said polishing head backing member, from sliding sideways beyond an inner boundary set for the substrate by said retaining ring member, wherein said substrate retaining ring member in use is urged toward the polishing pad by an first urging member located between the housing support member and the ring member assembly causing a portion of said retaining ring member to contact said polishing pad, and said retaining ring member is configured to interfere with a portion of said housing support member to prevent relative side motion between the retaining ring member and said housing support member, wherein said substrate retaining ring member is urged away from said polishing pad by a second urging member connected between the housing support member and the ring member assembly, such that said first urging member in a first mode creates a first urging force overcoming said urging force created by said second urging member and in a second mode creates a second urging force which does not overcome said urging force created by said second urging member.
Claim 14
Dependent Claim
216 words
An apparatus for holding a substrate during polishing as in Claim 12, further comprising a floating substrate retaining ring member assembly configured in use to generally surround said substrate to be polished to prevent the substrate, being pressed toward said polishing pad by said polishing head backing member, from sliding sideways beyond an inner boundary set for the substrate by said retaining ring member, wherein said substrate retaining ring member in use is urged toward the polishing pad by an first urging member located between the housing support member and the ring member assembly causing a portion of said retaining ring member to contact said polishing pad, and said retaining ring member is configured to interfere with a portion of said housing support member to prevent relative side motion between the retaining ring member and said housing support member. wherein said substrate retaining ring member is urged away from said polishing pad by a second urging member connected between the housing support member and the ring member assembly, such that said first urging member in a first mode creates a first urging force overcoming said urging force created by said second urging member and in a second mode creates a second urging force which does not overcome said urging force created by said second urging member.
Claim 15
Independent Claim
88 words
An apparatus for holding a substrate during polishing comprising a bellows member, wherein said polishing head substrate backing member is supported from a polishing head housing support member through the bellows member which in use provides a generally uniform force pressing the polishing head backing member toward a polishing pad generally irrespective of changes in the distance between the polishing head housing support member and the polishing pad as the polishing head pressing the substrate to be polished toward the polishing pad moves relative to the polishing pad.
Claim 16
Dependent Claim
216 words
An apparatus for holding a substrate during polishing as in Claim 15, further comprising a floating substrate retaining ring member assembly configured in use to generally surround said substrate to be polished to prevent the substrate, being pressed toward said polishing pad by said polishing head backing member, from sliding sideways beyond an inner boundary set for the substrate by said retaining ring member, wherein said substrate retaining ring member in use is urged toward the polishing pad by an first urging member located between the housing support member and the ring member assembly causing a portion of said retaining ring member to contact said polishing pad, and said retaining ring member is configured to interfere with a portion of said housing support member to prevent relative side motion between the retaining ring member and said housing support member, wherein said substrate retaining ring member is urged away from said polishing pad by a second urging member connected between the housing support member and the ring member assembly, such that said first urging member in a first mode creates a first urging force overcoming said urging force created by said second urging member and in a second mode creates a second urging force which does not overcome said urging force created by said second urging member.
Claim 17
Independent Claim
211 words
An apparatus for holding a substrate during polishing comprising a floating substrate retaining ring member assembly configured in use to generally surround said substrate to be polished to prevent the substrate, being pressed toward said polishing pad by said polishing head backing member, from sliding sideways beyond an inner boundary set for the substrate by said retaining ring member, wherein said substrate retaining ring member in use is urged toward the polishing pad by an first urging member located between the housing support member and the ring member assembly causing a portion of said retaining ring member to contact said polishing pad, and said retaining ring member is configured to interfere with a portion of said housing support member to prevent relative side motion between the retaining ring member and said housing support member, wherein said substrate retaining ring member is urged away from said polishing pad by a second urging member connected between the housing support member and the ring member assembly, such that said first urging member in a first mode creates a first urging force overcoming said urging force created by said second urging member and in a second mode creates a second urging force which does not overcome said urging force created by said second urging member.
Claim 18
Dependent Claim
125 words
A process for polishing a substrate on a polishing pad comprising the steps of: placing the substrate in contact with a polishing head backing member, wherein the polishing head backing member includes a pocket facing the back of the substrate, said member including a perimeter seal surrounding said pocket to form a generally fluid tight seal with said substrate in contact with said seal; positioning the substrate in contact with the polishing head backing member against a polishing pad; urging the polishing head backing member toward the polishing pad using a generally uniform force; controlling the fluid pressure in said pocket; and moving said substrate relative to the polishing pad to polish said substrate as the substrate rubs against a surface of a polishing pad.
Claim 19
Dependent Claim
117 words
A process for polishing a substrate in a polishing pad as in Claim 18; wherein the fluid pressure in said pocket achieves blow by conditions when the force urging the polishing head backing member toward the polishing pad causing the perimeter seal to seal against the substrate is overcome by the pressure in the pocket creating a force large enough to separate the substrate from the polishing head backing member and cause the fluid pressurizing the pocket to leak across the seal, and wherein the step of controlling the fluid pressure in said pocket further includes the step of controlling the fluid pressure in the pocket to a pressure near to, but less than blow by conditions.
Claim 20
Dependent Claim
64 words
A process for polishing a substrate on a polishing pad as in Claim 18 further comprising the step of restricting the sideways movement of the substrate relative to the polishing head backing member by providing a retaining ring encircling the substrate positioned against the polishing head backing member and which in use extends to and is urged against the surface of the polishing pad.
Claim 21
Dependent Claim
64 words
A process for polishing a substrate on a polishing pad as in Claim 19 further comprising the step of restricting the sideways movement of the substrate relative to the polishing head backing member by providing a retaining ring encircling the substrate positioned against the polishing head backing member and which in use extends to and is urged against the surface of the polishing pad.
Claim 22
Dependent Claim
88 words
A polishing head for positioning a surface of a substrate against a polishing member and providing a force on the substrate against the polishing surface, wherein the substrate includes a first surface thereon which is positionable against the pad for polishing and a second surface thereon disposed generally planar to the first surface, comprising: a substrate mounting member having a substrate receiving surface including a seal extendable therefrom and positionable against the second surface of the wafer; and a pocket formed between the substrate and said mounting member.
Claim 23
Dependent Claim
38 words
The polishing head of claim 22, wherein said mounting member includes an annular extending portion which circumscribes a pocket; and said seal provides a sealing interface between said annular extending portion and the second surface of the substrate.
Claim 24
Dependent Claim
13 words
The polishing head of claim 23, further including a pressurizable chamber disposed therein.
Claim 25
Dependent Claim
27 words
The polishing head of claim 24, wherein the polishing head is supported on the polishing surface by a support extendable at least partially over the polishing surface.
Claim 26
Dependent Claim
28 words
The polishing head of claim 25, wherein said chamber, when subjected to a pressure above atmospheric pressure, provides a force to load the substrate against the polishing surface.
Claim 27
Dependent Claim
34 words
The polishing head of claim 23, wherein said pocket is maintainable at a vacuum pressure to maintain the substrate in contact with the head when the substrate is not positioned on the polishing surface.
Claim 28
Dependent Claim
15 words
The polishing head of claim 27, further including a pressure source ported to said pocket.
Claim 29
Dependent Claim
15 words
The polishing head of claim 27, further including a pressure source ported to said chamber.
Claim 30
Dependent Claim
15 words
The polishing head of claim 27, further including a vacuum source ported to said pocket.
Claim 31
Dependent Claim
27 words
The polishing head of claim 22, further including a retainer at least partially circumscribing said mounting member and selectively positionable with respect to said substrate receiving surface.
Claim 32
Dependent Claim
26 words
The polishing head of claim 31, further including a retainer support member; and a first biasing member extendable between said retainer support member and said retainer.
Claim 33
Dependent Claim
20 words
The polishing head of claim 32, further including a second biasing member extending between said retainer support and said retainer.
Claim 34
Dependent Claim
32 words
The polishing head of claim 33, wherein said second biasing member provides a controllable, variable, bias on said retainer to extend said retainer outwardly of the position of said substrate receiving portion.
Claim 35
Dependent Claim
17 words
The polishing head of claim 34, wherein said second biasing member includes at least one pressurizable bladder.
Claim 36
Dependent Claim
16 words
The polishing head of claim 32, wherein said first biasing member includes at least one spring.
Claim 37
Dependent Claim
18 words
The polishing head of claim 23, wherein said seal circumscribes said substrate receiving portion and extends outwardly therefrom.
Claim 38
Dependent Claim
13 words
The polishing head of claim 37, wherein said seal is a lip seal.
Claim 39
Independent Claim
89 words
A method of polishing a surface of a substrate, wherein the substrate includes a first surface to be polished and a second surface disposed generally parallel thereto, comprising the steps of: providing a polishing head having a mounting portion thereon to receive the second surface of the substrate and position the first surface of the substrate on a polishing surface; forming a pocket between the substrate and the mounting portion by positioning the second surface of the substrate against the mounting portion; selectively varying the pressure in the pocket.
Claim 40
Dependent Claim
20 words
The method of claim 39, wherein a pressure above atmospheric is maintained in the pocket during polishing of the substrate.
Claim 41
Dependent Claim
28 words
The method of claim 39, further including the steps of evacuating the pocket to a pressure below atmospheric pressure when the substrate is removed from the polishing surface.
Claim 42
Dependent Claim
49 words
The method of claim 39, including the further steps of: positioning the carrier over the polishing surface on a support member; providing a chamber within the polishing head; and selectively pressurizing the chamber to provide a load force at the interface of the first surface and the polishing surface.
Claim 43
Dependent Claim
81 words
The method of claim 42, further including the steps of: positioning the substrate on a polishing surface with the polishing head; pressurizing the chamber to a first pressure to provide a contact pressure at the interface of the substrate second surface and the mounting portion; and pressurizing the pocket to reduce the contact pressure at the interface of the substrate and the mounting portion while simultaneously providing a uniform force load at the interface of the substrate and the polishing surface.
Claim 44
Dependent Claim
48 words
The method of claim 43, wherein the pressure in the pocket is insufficient to reduce the contact pressure between the substrate and the mounting portion below the pressure needed to maintain a frictional force maintaining the substrate in contact with the mounting portion as the mounting portion moves.
Claim 45
Dependent Claim
28 words
The method of claim 43, wherein the pressure in the pocket is insufficient to reduce the contact pressure between the substrate and the mounting portion to zero pressure.
Claim 46
Dependent Claim
43 words
The method of claim 39, further including the steps of: providing a pocket in the mounting portion; providing an annular portion about the perimeter of the pocket to form a mounting surface against which the second surface of the substrate may be positioned.
References Cited (Backward Citations)
No citation records indexed.
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