Patent US7006950B1 successfully refreshed from Google Patents.
Patent EP0735671A1 successfully refreshed from Google Patents.
EP0735671A1
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Surface acoustic wave devices
Assignee: Panasonic Holdings Corp
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Filing: 1996-03-28
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Granted: —
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Expires: 2016-03-28
Abstract
Abstract The invention is intended to present a surface acoustic wave device capable of preventing spreading of insulating resin and reducing in size. The constitution comprises a multi-layer substrate possessing input and output electrodes and grounding electrode on the mounting surface side of a dielectric layer, and possessing an outer electrode on the other surface of said electric layer, with said input and output electrodes and grounding electrode connected electrically with the outer electrode respectively, a surface acoustic wave element mounting a principal surface forming an electrode pad and comb-shaped electrode by face-down method, a metal bump applying a conductive resin on said electrode pad, and an insulating resin formed on the periphery of the metal bump, wherein said input and output electrodes, grounding electrode and surface acoustic wave element are electrically connected through the metal bump respectively, and a guard layer shorter in height than the surface acoustic wave element is formed outside of the surface acoustic wave element, on the mounting surface side of said multi-layer substrate.
Inventors
- 👤 Yasunobu Tsuji
- 👤 Yutaka Taguchi
- 👤 Keiji Onishi
- 👤 Kazuo Eda
- 👤 Katsuyuki Miyauchi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:43
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/058; H03H9/059; H03H9/0538; H03H9/0547; H03H9/10; H03H9/1064; H03H9/1071; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
160 words
A surface acoustic wave device comprising: a multi-layer substrate possessing input and output electrodes and grounding electrode on the mounting surface side of a dielectric layer, and possessing an outer electrode on the other surface of said dielectric layer, with said input and output electrodes and grounding electrode connected electrically with the outer electrode respectively, a surface acoustic wave element mounting a principal surface forming an electrode pad and comb-shaped electrode on said multi-layer substrate by face-down method, a metal bump applying a conductive resin, being formed on said electrode pad, and an insulating resin formed on the periphery of the metal bump, wherein said input and output electrodes and grounding electrode of said dielectric layer are electrically connected with said surface acoustic wave element through said metal bump, and a guard layer shorter in height than the surface acoustic wave element is formed outside of the surface acoustic wave element, on the mounting surface side of said multi-layer substrate.
Claim 2
Dependent Claim
38 words
A surface acoustic wave device of claim 1, wherein the piezoelectric substrate for composing the surface acoustic wave element is at least one selected from the group consisting of lithium tantalate, lithium niobate, lithium borate, and rock crystal.
Claim 3
Dependent Claim
18 words
A surface acoustic wave device of claim 1, wherein the metal bump is made of gold or aluminum.
Claim 4
Dependent Claim
28 words
A surface acoustic wave device of claim 1, wherein the guard layer is made of the same dielectric material as the dielectric layer for composing the multi-layer substrate.
Claim 5
Dependent Claim
58 words
A surface acoustic wave device of claim 1 or 4, wherein the material of the dielectric for composing the multi-layer substrate is a low temperature baking material that can be baked at 1000°C or less, and the conductors for composing the input and output electrodes, grounding electrode, and outer electrode are made of silver compound or copper compound.
Claim 6
Dependent Claim
39 words
A surface acoustic wave device of claim 1, wherein the guard layer is made of a metal ring, and the guard layer is electrically connected with the grounding electrode, and not electrically connected with the input and output electrodes.
Claim 7
Dependent Claim
28 words
A surface acoustic wave device of claim 1, wherein the metal bump is disposed on two confronting sides of the principal surface of the surface acoustic wave element.
Claim 8
Dependent Claim
37 words
A surface acoustic wave device of claim 7, wherein the metal bumps disposed on two confronting sides of the principal surface of the surface acoustic wave element are disposed alternately by two rows each on each side.
Claim 9
Dependent Claim
37 words
A surface acoustic wave device of claim 1, wherein a second guard layer is formed on the principal surface of the surface acoustic wave element so as to be positioned between the metal bump and comb-shaped electrode.
Claim 10
Dependent Claim
31 words
A surface acoustic wave device of claim 9, wherein the second guard layer formed on the principal surface of the surface acoustic wave element is made of a sound absorbing material.
Claim 11
Dependent Claim
57 words
A surface acoustic wave device of claim 1, wherein the multi-layer substrate mounting the surface acoustic wave element is formed in plural layers, at least one grounding electrode layer is interposed in the plural-layer substrate, and the grounding electrode formed on the upper principal surface of the multi-layer substrate is electrically connected with said grounding electrode layer.
Claim 12
Dependent Claim
97 words
A surface acoustic wave device of claim 1, wherein the multi-layer substrate mounting the surface acoustic wave element is formed in a laminate structure of at least four layers, grounding electrode layers are formed on the principal surface side of the second layer and fourth layer from the top, a matching circuit unit composed of strip lines and capacitor electrode is formed on the principal surface side of the third layer from the top, and this matching circuit unit is electrically connected with the input and output electrodes formed on the principal surface of the first layer.
References Cited (Backward Citations)
JPH0456510A
Cited
EP0637871A1
Cited
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