Patent EP0731506A2 successfully refreshed from Google Patents.
EP0731506A2
Expired / Lapsed
EP
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Package for semiconductor device
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1996-03-05
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Granted: —
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Expires: 2016-03-05
Abstract
Abstract A semiconductor package includes a resin film (12) having an upper surface on which conductive patterns (18) are formed and a semiconductor element (16) is to be mounted. A base substrate (10) has an upper surface on which intermediate conductive patterns (27) are formed and a lower surface on which external terminal connecting pads (24), to which external terminals (26) are to be connected, are formed. The intermediate conductive patterns (27) are electrically connected to the external terminal connecting pads (24) by means of vias (20) provided in the base substrate (10). An adhesive layer (14) adheres the lower surface of the resin film (12) to the upper surface of the base substrate (10). Conductors (30,36,42) provided in through holes (28) penetrate through the resin film (12) and preferably through the adhesive layer (14) to electrically connect the conductive patterns (18) on the upper surface of the resin film (12) to the external terminal connecting pads (24) on the lower surface of the base substrate (10) by means of the intermediate conductive patterns (27) on the upper surface of the base substrate (10).
Inventors
- 👤 Yukiharu c/o Shinko Elec. Ind. Co. Ltd. Takeuchi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 17:13
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/69; H10W70/692; H10W74/01; H10W74/016; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
199 words
A semiconductor package comprising: a resin film (12) having a first, upper surface on which conductive patterns (18) are formed and at least one semiconductor element (16) is to be mounted and a second, lower surface; a base substrate (10) having a first, upper surface on which intermediate conductive patterns (27) are formed and a second, lower surface on which external terminal connecting pads (24) to which external terminals (26) are to be connected are formed, said intermediate conductive patterns (27) are electrically connected to said external terminal connecting pads (24) by means of vias (22) provided in said base substrate; an adhesive layer (14) for adhering said second, lower surface of the resin film (12) to said first, upper surface of the base substrate (1); and connecting means (30,40,42) provided in through holes (28) penetrating through said resin film (12) and in said adhesive layer (14) for electrically connecting said conductive patterns (18) on said first, upper surface of the resin film (12) to said external terminal connecting pads (24) on said second, lower surface of the base substrate (10) by means of said intermediate conductive patterns (27) on the first, upper surface of the base substrate (10).
Claim 2
Dependent Claim
55 words
A semiconductor package according to claim 1, wherein said connecting means for electrically connecting said conductive patterns (18) to said external terminal connecting pads (24) comprises said through holes (28) penetrating through said resin film (12) and said adhesive layer (14) being filled with conductive paste (30) or being plated (36) on their inner walls.
Claim 3
Dependent Claim
42 words
A semiconductor package according to claim 1, wherein said connecting means comprises metal plated layers (36) formed on inner walls of said through holes (28), and portions (40) of said anisotropic conductive adhesive paste at locations corresponding to said through holes (28).
Claim 4
Dependent Claim
44 words
A semiconductor package according to any one of the preceding claims, wherein said conductive patterns (18) on the first, upper surface of the resin film (12) are finer than said intermediate conductive patterns (27) on the first, upper surface of the base substrate (10).
Claim 5
Dependent Claim
58 words
A semiconductor package according to any one of the preceding claims, wherein each of said vias (20) provided in the base substrate (10) comprises a through hole provided in said base substrate (10) and a metal plated layer (22) formed on the inner wall of said through hole and/or said through hole is filled with conductive paste (46).
Claim 6
Dependent Claim
26 words
A semiconductor package according to any one of the claims, wherein said base substrate (10) comprises a glass fiber reinforced plastic substrate or a ceramic substrate.
Claim 7
Dependent Claim
56 words
A semiconductor device comprising a semiconductor package in accordance with any one of the preceding claims, at least one semiconductor element (16) mounted on said conductive patterns (18) on the first, upper surface of the resin film (12); and a sealing resin (34) for hermetically sealing and covering the at least one said semiconductor element (16).
Claim 8
Dependent Claim
219 words
A process for making a semiconductor package comprising: preparing a base substrate (10) having a first, upper surface on which intermediate conductive patterns (27) are formed and a second, lower surface on which external terminal connecting pads (24) to which external terminals (26) are to be connected are formed, said intermediate conductive patterns (27) are electrically connected to said external terminal connecting pads (24) by means of vias (20) provided in said base substrate (10); preparing a resin film (12) having a first, upper surface on which conductive patterns (18) are formed and a second, lower surface; adhering said second, lower surface of the resin film (12) to said first, upper surface of the base substrate (10) by means of an adhesive layer (14); providing through holes (28) so as to penetrate through at least said resin film (12) at positions corresponding to said intermediate conductive patterns (27) of the base substrate (10); and filling said through holes with conductive paste (30) or forming metal plated layers (42) on their inner walls to electrically connect said conductive patterns (18) on said first, upper surface of the resin film (12) to said external terminal connecting pads (24) on said second, lower surface of the base substrate (10) by means of said intermediate conductive patterns (27) of the base substrate (10).
Claim 9
Dependent Claim
94 words
A process for making a semiconductor package according to claim 8, wherein said adhesive layer comprises an anisotropic conductive adhesive paste (38,40) ; and wherein metal plated layers (36) are formed on said inner walls of said through holes (28) to electrically connect said conductive patterns (18) on said first, upper surface of the resin film (12) to said external terminal connecting pads (24) on said second, lower surface of the base substrate (10) by means of said anisotropic conductive adhesive paste (40) and said intermediate conductive patterns (27) of the base substrate (10).
References Cited (Backward Citations)
No citation records indexed.
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