Patent EP0720232A1 successfully refreshed from Google Patents.
EP0720232A1
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EP
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Multi-chip module
Assignee: Toshiba Corp
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Filing: 1994-09-14
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Granted: —
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Expires: 2014-09-14
Abstract
Abstract Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board. Lead pads (107) and the outer electrode pads (105) are interconnected through a circuit pattern (109), through holes (111) and interstitial via holes (112). The circuit pattern (109) is disposed on a die bonding surface of the bare IC chips (201 and 202) for which insulation is not necessary. A multi-chip module is thus completed.
Inventors
- 👤 Masayoshi 2-22 Nishimachi 1-chome YAMAGUCHI
- 👤 Mitsutoshi 13-23 Soshigaya 3-chome SAWANO
- 👤 Kazutoshi 20-6 Higashi-Toyoda 3-chome HOHKI
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 17:04
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W70/00; H10W70/60; H10W70/611; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/401; H05K1/147; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/36; H05K3/368; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4623; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
82 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized by: outer electrode pads (105), disposed on the peripheral portion of said printed wiring board, for soldering said printed wiring board to said another printed wiring board (1), each pad having a geometry which cutting a through hole in the axis direction of said through hole yields.
Claim 2
Dependent Claim
86 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: a circuit pattern is provided on each of at least one of the areas of said printed wiring board (100) on which said plurality of bare IC chips (201, 202, 203) are mounted; and an insulating layer (115) is provided on each of said at least one circuit pattern.
Claim 3
Dependent Claim
61 words
The multi-chip module as defined in claim 1 further characterized in that: a circuit pattern is provided on each of at least one of the areas of said printed wiring board (100) on which said plurality of bare IC chips (201, 202, 203) are mounted; and an insulating layer (115) is provided on each of said at least one circuit pattern.
Claim 4
Dependent Claim
100 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: at least one of a printed resistor element and a printed dielectric is provided on each of at least one of the areas of said printed wiring board on which said plurality of bare IC chips (201, 202, 203) are mounted; and an insulating layer is provided on each of said at least one of said printed resistor element and said printed dielectric.
Claim 5
Dependent Claim
80 words
The multi-chip module as defined in any of claims 1 through 3 further characterized in that: at least one of a printed resistor element and a printed dielectric is provided on each of at least one of the areas of said printed wiring board (100) on which said plurality of bare IC chips (201, 202, 203) are mounted; and an insulating layer is provided on each of said at least one of said printed resistor element and said printed dielectric.
Claim 6
Dependent Claim
103 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: said printed wiring board (100) has a multi layer structure; said printed wiring board being provided with inner layers each including a conductive pattern and connecting portions connecting the bare IC chip mounting side to said inner conductor layers in said multi layer structure; and said bare IC chips (201, 202, 203) are electrically connected to one another via said connecting portions and said conductive pattern.
Claim 7
Dependent Claim
80 words
The multi-chip module as defined in any of claims 1 through 5 further characterized in that: said printed wiring board (100) has a multilayer structure; said printed wiring board being provided with inner layers each including a conductive pattern and connecting portions connecting the bare IC chip mounting side to said inner conductor layers in said multilayer structure; and said bare IC chips (201, 202, 203) are electrically connected to one another via said connecting portions and said conductive pattern.
Claim 8
Dependent Claim
83 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there is provided at least one resistor element both the ends of which are electrically connected to at least one conductive pattern of said inner layers.
Claim 9
Dependent Claim
62 words
The multi-chip module as defined in any of claims 1 through 7 further characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there is provided at least one resistor element both the ends of which are electrically connected to at least one conductive pattern of said inner layers.
Claim 10
Dependent Claim
87 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there is provided at least one dielectric layer both the sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.
Claim 11
Dependent Claim
66 words
The multi-chip module as defined in any of claims 1 through 7 further characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there is provided at least one dielectric layer both the sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.
Claim 12
Dependent Claim
115 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there are provided at least one resistor element both the ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure and at least one dielectric layer both the sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.
Claim 13
Dependent Claim
94 words
The multi-chip module as defined in any of claims 1 through 7 further characterized in that: said printed wiring board (100) has a multilayer structure including a plurality of inner layers; and within said multilayer structure, there are provided at least one resistor element both the ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure and at least one dielectric layer both the sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.
Claim 14
Dependent Claim
76 words
The multi-chip module as defined in any of claims 1 through 13 further characterized in that: at least one of a printed resistor element and a printed dielectric permitting a trimming for adjustment of the resistance of said printed resistor element and/or the capacitance associated with said printed dielectric is provided outside the areas on the surface of said printed wiring board (100) on which said plurality of bare IC chips (201, 202, 203) are mounted.
Claim 15
Dependent Claim
76 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized by: a frame provided on said printed wiring board (100) so that said frame encloses said plurality of bare IC chips (201, 202, 203), the inside of said frame is filled with resin, and said resin seals said bare IC chips.
Claim 16
Dependent Claim
55 words
The multi-chip module as defined in any of claims 1 through 14 further characterized by: a frame provided on said printed wiring board (100) so that said frame encloses said plurality of bare IC chips (201, 202, 203), the inside of said frame is filled with resin, and said resin seals said bare IC chips.
Claim 17
Dependent Claim
35 words
The multi-chip module as defined in any of claims 15 through 16 further characterized in that: said frame is provided with a reinforcing part railing between two of said bare IC chips (201, 202, 203).
Claim 18
Dependent Claim
79 words
The multi-chip module as defined in any of claims 15 through 17 further characterized in that: chip electrode pads are disposed on the periphery of said bare IC chips (201, 202, 203) on the bare IC chip mounting side of said printed wiring board (100), so that the boundary between said chip electrode pads and the area surrounding said pads serves as reference for positioning of said frame when said frame is mounted on said printed wiring board (100).
Claim 19
Dependent Claim
83 words
The multi-chip module as defined in any of claims 15 through 17 further characterized in that: chip electrode pads are disposed on the periphery of said bare IC chips (201, 202, 203) on the bare IC chip mounting side of said printed wiring board (100), and a solder resist is provided adjacent to said chip electrode pads, so that the boundary between said chip electrode pads and said solder resist serves as reference for positioning of said frame when said frame is mounted.
Claim 20
Dependent Claim
48 words
The multi-chip module as defined in any of claims 15 through 19 further characterized in that: said frame is filled with resin for sealing said bare IC chips (201, 202, 203) so that the surface of said resin is not higher than the upper face of said frame.
Claim 21
Dependent Claim
37 words
The multi-chip module as defined in any of claims 1 through 20 further characterized in that: said bare IC chips (201, 202, 203) are mounted on said printed wiring board (100) by means of flip chip bonding.
Claim 22
Dependent Claim
63 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized by: through holes provided on the peripheral portion of said printed wiring board (100) as outer electrode pads to be soldered to said another printed wiring board (1).
Claim 23
Dependent Claim
63 words
A multi-chip module which comprises a printed wiring board (100) and a plurality of bare IC chips (201, 202, 203) and which is mounted on another printed wiring board (1), the multi-chip module being characterized by: outer electrode pads to be soldered to said another printed wiring board (1), each pad being provided along the peripheral portion of said printed wiring board (100).
Claim 24
Dependent Claim
43 words
The multi-chip module as defined in claim 1 further characterized in that: said outer electrode pads are soldered to lands of said another printed wiring board (1) with the multi-chip module face to face with or perpendicular to said another printed wiring board.
Claim 25
Dependent Claim
49 words
The multi-chip module as defined in claim 15 further characterized in that: said bare IC chips (201, 202, 203) are enclosed by said frame, said bare IC chips are sealed by filling said frame with resin, and other bare IC chips are disposed on said frame and said resin.
Claim 26
Dependent Claim
62 words
The multi-chip module as defined in claim 1 further characterized in that: said printed wiring board (100) is provided with holes or concavities in which said bare IC chips (201, 202, 203) are disposed; and said bare IC chips (201, 202, 203) are disposed in said holes or concavities and connected to said printed wiring board (100) by means of wire bonding.
Claim 27
Dependent Claim
51 words
The multi-chip module as defined in claim 1 further characterized in that: said another printed wiring board (1) is provided with a hole; the multi-chip module is inserted in said hole; and said external electrode pads of the multi-chip module are soldered to lands of said another printed wiring board (1).
Claim 28
Dependent Claim
39 words
The multi-chip module as defined in any of claims 1, 18, 19, 22 and 23 further characterized in that: said bare IC chips (201, 202, 203) are directly connected to said outer electrode pads by means of wire bonding.
Claim 29
Dependent Claim
52 words
The multi-chip module as defined in any of claims 4, 5 and 14 further characterized in that: a printed conductor which serves as an inductance for processing a high frequency signal is provided on said printed wiring board with said at least one of a printed resistor element and a printed dielectric.
Claim 30
Dependent Claim
44 words
The multi-chip module as defined in any of claims 1, 2, 4, 6, 8, 10, 12, 15, 22 and 23 further characterized in that: a flexible printed wiring board is used as another printed wiring board (1) on which the multi-chip module is mounted.
Claim 31
Dependent Claim
45 words
The multi-chip module as defined in claim 15 further characterized in that: said frame is formed of a metal member and said bare IC chips (201, 202, 203) are sealed with heat conductive resin so as to facilitate heat radiation from said bare IC chips.
Claim 32
Dependent Claim
63 words
The multi-chip module as defined in claim 15 further characterized in that: said frame is formed of a metal member in such a shape that the top of said frame is extend to cover said bare IC chips (201, 202, 203), and said bare IC chips are sealed with heat conductive resin so as to facilitate heat radiation from said bare IC chips.
Claim 33
Dependent Claim
45 words
The multi-chip module as defined in any of claims 1, 2, 4, 6, 8, 10, 12, 15, 22 and 23 further characterized by: a conductive cover for shielding said bare IC chips (201, 202, 203) disposed on said printed wiring board (100) from electromagnetic field.
Claim 34
Dependent Claim
42 words
The multi-chip module as defined in any of claims 1, 2, 4, 6, 8, 10, 12, 15, 22 and 23 further characterized by: a conductive cover for shielding the multi-chip module disposed on said another printed wiring board (1) from electromagnetic field.
Claim 35
Dependent Claim
39 words
The multi-chip module as defined in any of claims 6, 8, 10, 12 and 13 further characterized in that: said printed wiring board (100) of said multilayer structure is formed of ceramic material, glass epoxy material, and/or resin material.
References Cited (Backward Citations)
No citation records indexed.
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