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EP0713142A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Combined attenuated-alternating phase shifting mask structure and fabrication methods therefor

Assignee: International Business Machines Corp
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Filing: 1995-11-17
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Granted: —
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Expires: 2015-11-17
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Abstract

Abstract A structure and fabrication method for a phase-shifting lithographic mask wherein an attenuated phase-shifting mesh structure (Att PSM) is combined with an alternating-element phase shifting mask (Alt PSM) to provide a mask combination consisting of phase-shifted and unshifted attenuated backgrounds in which the phase-shifted attenuated backgrounds surrounds the unshifted components and the unshifted attenuated background surrounds the phase-shifted components. A substrate (10), composed for example of quartz, has discrete layers of phase shift material (12) such as silicon nitride (Si₃N₄). The phase shifter (12) provides a 180 degree phase shift to light transmitted through it. Transparent regions (14) which also may be composed of quartz are disposed on the phase shifters (12) and attenuator material (16) is disposed on the top of regions (14). The majority of the attenuator regions of the mask are slightly transmissive absorbers and π shifted openings such as the background (K) with respect to openings (C, E, G and J). The slightly transmissive, π shifted absorber (H, A and I) is composed, for example, of chromium plus a phase shifting layer. In the areas where isolated, small, opaque features are required, the unattenuated phase shifter (B) is used instead of the Att PSM. Where there are closely packed patterns (C, D, E, F and G), every other element (D and G) is shifted by -π. The shifted elements are each decorated by a rim that has the same transmission as the Att PSM but shifts 3π. In the present configuration, each of the closely packed elements is surrounded by an attenuated phase shifter; whereas, it is also π-shifted respect to its close neighbor. The extra opaque line between the shifted and unshifted elements (H and I) do not print, because they are imbedded in a background of low transmission. These elements are 3π shifted (equivalent to π shift) while the background area (K) is 4π shifted (equivalent to zero phase shift).

Inventors

  • 👤 Jeng Lin Burn

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-07 22:39
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/26; G03F1/32; G03F1/30

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 93 words
A phase-shifting mask structure having composite pattern material disposed on a substrate and comprising: a substantially transparent substrate, discrete component layers of radiation phase shifting material disposed on selected regions of said substrate, discrete component layers of radiation attenuating material disposed on selected regions of said substrate, discrete component layers of radiation phase shifting material disposed on selected regions of said layers of attenuating material, said discrete component layers of said radiation phase shifting material being disposed in separate alternating regions of adjacent zero radian phase shift and π radian phase shift material.
Claim 2
Dependent Claim 28 words
A phase-shifting mask structure having phase-shifted, unphase-shifted and attenuated regions according to claim 1 wherein shifted, attenuated regions surround unshifted regions and unshifted, attenuated regions surround shifted regions.
Claim 3
Dependent Claim 31 words
A phase-shifting mask structure according to claim 2 including attenuated regions with zero radians phase shift and phase-shifted regions with a π-φ phase shift components where φ is substantially 30 degrees.
Claim 4
Dependent Claim 15 words
A phase-shifting mask structure according to claim 3 further including a 2π-φ phase shift component.
Claim 5
Dependent Claim 15 words
A phase-shifting mask structure according to claim 3 further including a 3π-φ phase shift component.
Claim 6
Dependent Claim 15 words
A phase-shifting mask structure according to claim 3 further including a 4π-φ phase shift component.
Claim 7
Independent Claim 147 words
A method for fabricating a phase-shifting mask comprising the steps of: Step 1   disposing a layer of transmissive absorber material on a substantially transparent substrate, Step 2   disposing phasing-shifting material on said absorber material to provide a composite attenuated phase-shifting layer, Step 3   disposing a first layer of photoresist on said composite layer and exposing and patterning said photoresist, delineating and etching said phase-shifting material, said absorber material and said quantity substrate to form a pattern of separate discrete portions of quantity, absorber and phase-shift material on said substrate, Step 4   applying a layer of photoresist on said substrate and discrete layers formed in Step 3, Step 5   exposing and etching said photoresist to form an etch mask over selected regions of said discrete portions of phase-shift material, and Step 6   etching said discrete portions of phase-shift material to remove said selected regions of said phase-shift material.
Claim 8
Dependent Claim 17 words
A method according to claim 7 wherein said phase-shift material in step 6 is removed by lift-off.

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