Patent EP0706152A2 successfully refreshed from Google Patents.
EP0706152A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Chip card and method for fabricating it
Assignee: FELA MANAGEMENT AG
•
Filing: 1995-10-24
•
Granted: —
•
Expires: 2015-10-24
Abstract
Abstract The chip card has an outer foil (1) acting as a circuit board substrate with structured conductor paths cooperating with the chip (6), which is mounted on the outer foil via a flip-chip technique using a conductive adhesive. The chip is enclosed by a core foil (2) with a corresponding locating aperture (9) and covered by a cover foil (3). All of the foils are made of a thermoplastics material, for bonding together upon application of pressure and heat, with the conductive adhesive hardened during the lamination process.
Inventors
- 👤 Ernst Uhlmann
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 20:05
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07749; G06K19/07766; G06K19/07769; G06K19/07743; G06K19/07745; G06K19/0775; G06K19/07773; G06K19/07777; G06K19/07779; G06K19/07783
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.