Process of manufacturing a structure having a thin semiconductor layer on a substrate

Abstract

Abstract Translated from French Procédé de fabrication d'une structure comportant une couche mince (4) semi-conductrice adhérente sur un substrat cible (24) . Le procédé comporte les étapes suivantes : a) - fabrication d'une première structure comportant une couche mince (4) semi-conductrice sur un premier substrat, b) - transfert de la couche mince (4) du premier substrat sur le substrat (24) dit substrat cible. Method for manufacturing a structure comprising a thin semiconductor layer (4) adhering to a target substrate (24). The process includes the following steps: a) - manufacturing a first structure comprising a thin semiconductor layer (4) on a first substrate, b) - transfer of the thin layer (4) from the first substrate to the substrate (24) called the target substrate. Application à la fabrication de composants électroniques. Application to the manufacture of electronic components.

Inventors

• 👤 Michel Bruel
• 👤 Thierry Poumeyrol

Bibliographic Details