Patent EP0693779A2 successfully refreshed from Google Patents.
EP0693779A2
Expired / Lapsed
EP
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Resin sealing type semiconductor device and method of making the same
Assignee: Seiko Epson Corp
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Filing: 1995-06-21
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Granted: —
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Expires: 2015-06-21
Abstract
Abstract The invention provides a resin sealing type semiconductor device and fabrication method thereof. The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. A highly flexible wiring arrangement design is provided by using leads commonly. The resin sealing type semiconductor device includes an element mounting portion having an element mounting surface. A semiconductor element is bonded to the element mounting surface. A plurality of leads is provided and is separated from the semiconductor element, a frame lead is disposed between these leads and the semiconductor element and not in contact with either the semiconductor element or the leads. Wires are provided for electrical connections and a resin seals the element mounting portion, the semiconductor element, parts of the leads and the frame lead.
Inventors
- 👤 Tetsuya Otsuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/127; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
175 words
A resin sealing type semiconductor device, comprising: an element mounting member having an element mounting surface for mounting a semiconductor element, said semiconductor element bonded to said element mounting surface of said element mounting member; a plurality of leads disposed on and insulated from said element mounting member, said plurality of leads being separated from said semiconductor element; a frame lead disposed around a periphery of said semiconductor element and separated from said semiconductor element and said element mounting surface, said frame lead being continuous around said periphery of said semiconductor element; a plurality of wires including at least one of first wires electrically connecting a first number of said leads to a first number of electrodes of said semiconductor element, second wires electrically connecting a second number of said leads to said frame lead, and third wires electrically connecting said frame lead to a second number of said electrodes of said semiconductor element; and a resin sealing said element mounting member, said semiconductor element, parts of said plurality of leads and said frame lead.
Claim 2
Dependent Claim
41 words
The resin sealing type semiconductor device as defined in claim 1, wherein each of said leads comprises an inner lead and an outer lead, a free end of said inner lead overlapping said element mounting surface of said element mounting member.
Claim 3
Dependent Claim
84 words
The resin sealing type semiconductor device as defined in claim 2, wherein an insulating lead support is bonded to said element mounting member and said inner lead of each of said leads so that a portion of said insulating lead support is in-between said element mounting member and said inner lead of each of said leads, said insulating lead support allowing said free end of said inner lead of each of said leads to contact said element mounting surface of said element mounting member.
Claim 4
Dependent Claim
42 words
The resin sealing type semiconductor device as defined in claim 3, wherein said insulating lead support is formed around an entire periphery of said element mounting surface, said insulating lead support being continuous around said entire periphery of said element machine surface.
Claim 5
Dependent Claim
27 words
The resin sealing type semiconductor device as defined in claim 3, wherein said insulating lead support is formed partially around the periphery of said element mounting surface.
Claim 6
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 5, wherein said element mounting member comprises a substance having high thermal conductivity.
Claim 7
Dependent Claim
27 words
The resin sealing type semiconductor device as defined in claim 6, wherein said element mounting member comprises substantially at least one of copper, aluminum, silver and gold.
Claim 8
Dependent Claim
70 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 7, wherein at least one of a first conducting layer and a second conducting layer is formed on said element mounting surface, said first conducting layer providing a ground for a number of said electrodes of said semiconductor element and said second conducting layer providing a ground for a number of said plurality of leads.
Claim 9
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in claim 8, wherein said first and second conducting layers comprise at least one of silver, gold, palladium and aluminum.
Claim 10
Dependent Claim
25 words
The resin sealing type semiconductor device as defined in claim 8, wherein said first and second conducting layers are formed in a mutually separated manner.
Claim 11
Dependent Claim
24 words
The resin sealing type semiconductor device as defined in claim 8, wherein said first and second conducting layers are formed in a continuous manner.
Claim 12
Dependent Claim
51 words
The resin sealing type semiconductor device as defined in any one of claims 8 to 11, wherein an insulating layer is formed on the surface of said element mounting member, said insulating layer and said first and second conductive layers being mutually exclusive on the surface of said element mounting member.
Claim 13
Dependent Claim
26 words
The resin sealing type semiconductor device as defined in claim 12, wherein said insulating layer comprises an oxide film obtained by oxidizing said element mounting member.
Claim 14
Dependent Claim
57 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 13, wherein said element mounting member comprises a large portion and a small portion projecting from said large portion, a surface of said large portion being said element mounting surface, a cross-section of said large and small portions having an inverted T-shape.
Claim 15
Dependent Claim
33 words
The resin sealing type semiconductor device as defined in claim 14, wherein said resin seals said element mounting member except for a top surface of said small portion of said element mounting member.
Claim 16
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in claim 14 or 15, wherein said top surface of said small portion of said element mounting member is convex.
Claim 17
Dependent Claim
64 words
The resin sealing type semiconductor device as defined in any one of claims 14 to 16, wherein said small portion of said element mounting member comprises a top surface and side surfaces, said small portion having an under cut so that a cross-section of said small portion has a cross-sectional length of said top surface greater than a cross-sectional length of said side surfaces.
Claim 18
Dependent Claim
45 words
The resin sealing type semiconductor device as defined in any one of claims 15 to 17, wherein said large portion of said element mounting member has resin penetration holes, said resin penetration holes having axes perpendicular to said element mounting surface of said large portion.
Claim 19
Dependent Claim
35 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 13, wherein a solder layer is formed on said top surface of said small portion of said element mounting member.
Claim 20
Dependent Claim
35 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 19, wherein a solder layer is formed on said top surface of said small portion of said element mounting member.
Claim 21
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 22, wherein said frame lead has identifying projections for wire bonding image recognition.
Claim 22
Dependent Claim
28 words
The resin sealing type semiconductor device as defined in any one of claims 1 to 23, wherein said frame lead has identifying projections for wire bonding image recognition.
Claim 23
Dependent Claim
20 words
The resin sealing type semiconductor device as defined in claim 2, wherein said frame lead is a power supply lead.
Claim 24
Dependent Claim
20 words
The resin sealing type semiconductor device as defined in claim 23, wherein said frame lead is a power supply lead.
Claim 25
Independent Claim
169 words
A method of fabricating a resin sealing type semiconductor device, comprising: bonding a semiconductor element to an element mounting surface of an element mounting member; disposing a plurality of leads on said element mounting member, said plurality of leads being insulated and separated from said semiconductor element; disposing a frame lead around a periphery of said semiconductor element, said frame lead being separated from said semiconductor element and said element mounting surface, said frame lead being continuous around the periphery of said semiconductor element; forming a plurality of wires including at least one of first wires electrically connecting a first number of said leads to a first number of electrodes of said semiconductor element, second wires electrically connecting a second number of said leads to said frame lead, and third wires electrically connecting said frame lead to a second number of said electrodes of said semiconductor element; and sealing said element mounting member, said semiconductor element, parts of said plurality of leads and said frame lead with a resin.
Claim 26
Dependent Claim
116 words
The method of claim 25, wherein said semiconductor element is bonded to said element mounting surface in a fixed position using electrically conductive adhesive, a lead frame comprises said plurality of leads and said frame lead, said lead frame is bonded to said element mounting member with an adhesive having an insulating lead support in-between said element mounting member and said lead frame, said plurality of wires is connected to at least one of electrodes of said semiconductor element and frame lead by using a wire bonding device, and said resin seals said mounting member, said semiconductor element, parts of said plurality of leads and said frame lead by a molding process using a metal mold.
Claim 27
Dependent Claim
53 words
The method of claim 26, wherein said first and second wires are connected to said first and second numbers of said leads by depressing inner leads corresponding to the first and second wires with lead pressers so that ends of said inner leads contact said element mounting surface of said element mounting member.
References Cited (Backward Citations)
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