Patent EP0684648A2 successfully refreshed from Google Patents.
EP0684648A2
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EP
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Method for producing semiconductor device
Assignee: Sharp Corp
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Filing: 1995-05-24
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Granted: —
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Expires: 2015-05-24
Abstract
Abstract A method for producing a semiconductor device according to the present invention includes the steps of: disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward; overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating on the multi-cavity circuit board so as to cover all of the cavities thereof; heating and pressurizing the sealing resin sheet on the multi-cavity circuit board so that the sealing resin sheet is melted to be filled in each of the cavities; and curing the molten resin filled in each of the cavities.
Inventors
- 👤 Masahiro Konishi
- 👤 Masako Yabe
- 👤 Toshiro Hida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 22:35
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; G; G02; G02B; G02B3/00; G02B3/0006; G02B3/0037; G02B3/005; G02B3/0056; H10W; H10W74/00; H10W74/01; H10W90/00; H10H20/8506; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
120 words
A method for producing a semiconductor device comprising the steps of: disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward; overlaying a sealing resin sheet with predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating, on the multi-cavity circuit board so as to cover all of the cavities thereof; heating and pressurizing the sealing resin sheet on the multi-cavity circuit board so that the sealing resin sheet is melted to be filled in each of the cavities; and curing the molten resin filled in each of the cavities.
Claim 2
Dependent Claim
32 words
A method for producing a semiconductor device according to claim 1, wherein the sealing resin sheet is brought into contact with the multi-cavity circuit board under vacuum to be heated and pressurized.
Claim 3
Dependent Claim
31 words
A method for producing a semiconductor device according to claim 2, wherein the sealing resin sheet is heat-pressed together with the multi-cavity circuit board under vacuum to be heated and pressurized.
Claim 4
Dependent Claim
36 words
A method for producing a semiconductor device according to claim 1, wherein the sealing resin sheet is heated and pressurized under a condition of being pressed by a peeling sheet for surface-finish with a matte surface.
Claim 5
Dependent Claim
20 words
A method for producing a semiconductor device according to claim 1, wherein a through hole is provided in each cavity.
Claim 6
Dependent Claim
31 words
A method for producing a semiconductor device according to claim 1, wherein a through hole is provided in a portion of the sealing resin sheet opposing to each of the cavities.
Claim 7
Dependent Claim
30 words
A method for producing a semiconductor device according to claim 1, wherein a plurality of the sealing resin sheets each having a different elastic modulus are overlaid one on another.
Claim 8
Dependent Claim
29 words
A method for producing a semiconductor device according to claim 1, wherein the functional element is an optical element and the sealing resin has light transparency after being cured.
Claim 9
Dependent Claim
57 words
A method for producing a semiconductor device according to claim 8, wherein a resin sheet for molding a lens having light transparency is overlaid on the sealing resin sheet and the resin sheet for molding a lens is molded into a desired lens shape when the sealing resin sheet is melted, fills a cavity, and is cured.
Claim 10
Dependent Claim
20 words
A method for producing a semiconductor device according to claim 1, wherein the sealing resin is a thermosetting modified polyolefin.
Claim 11
Dependent Claim
25 words
A method for producing a semiconductor device according to claim 1, wherein the sealing resin is a modified phenoxy resin having a curable unsaturated portion.
Claim 12
Dependent Claim
37 words
A method for producing a semiconductor device according to claim 1, wherein the sealing resin is a high molecular weight unsaturated polyester having a number average molecular weight of not less than 5000 or modified materials thereof.
Claim 13
Independent Claim
95 words
A method for producing a semiconductor device comprising the steps of: disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward; filling each of the cavities with resin fine powders containing, as a sealing resin, one of a thermo-plastic resin and thermosetting resin which is melted by heating and is cured by further heating; heating the resin fine powders filling each of the cavities so as to melt the resin fine powders; and curing the molten resin filling each of the cavities.
Claim 14
Dependent Claim
20 words
A method for producing a semiconductor device according to claim 13, wherein the sealing resin is a thermo-setting modified polylefin.
Claim 15
Dependent Claim
25 words
A method for producing a semiconductor device according to claim 13, wherein the sealing resin is a modified phenoxy resin having a curable unsaturated portion.
Claim 16
Dependent Claim
37 words
A method for producing a semiconductor device according to claim 13, wherein the sealing resin is a high molecular weight unsaturated polyester having a number average molecular weight of not less than 5000 or modified materials thereof.
Claim 17
Independent Claim
102 words
A method for producing a semiconductor device comprising the steps of: disposing a plurality of functional elements on a surface of flat circuit board; overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating, and having concave portions which cover the respective functional elements on the flat circuit board, on the flat circuit board; and molding the sealing resin sheet on the flat circuit board into desired shape and sealing the respective functional elements in the desired shape.
Claim 18
Dependent Claim
29 words
A method for producing a semiconductor device according to claim 17, wherein the functional element is an optical element, and the sealing resin has light transparency after being cured.
Claim 19
Dependent Claim
23 words
A method for producing a semiconductor device according to claim 16, wherein the sealing resin sheet is molded into a desired lens shape.
Claim 20
Independent Claim
148 words
A method for producing a semiconductor device comprising the steps of: disposing a plurality of light-emitting diodes on a surface of a flat circuit board; overlaying a reflective plate with a reflective function, having openings capable of accommodating each of the light-emitting diodes, on the flat circuit board so that each of the light-amitting diodes is accommodated in each of the openings; overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating, on the reflective plate; heating and pressurizing the sealing resin sheet on the reflective plate so that the sealing resin sheet is melted to be filled in each of the openings of the reflective plate; covering an entire surface of the reflective plate with the molten resin; and curing the molten resin.
References Cited (Backward Citations)
No citation records indexed.
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