Patent EP0684641A2 successfully refreshed from Google Patents.
EP0684641A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device moulding capable of accomplishing a high moisture proof
Assignee: NEC Electronics Corp
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Filing: 1995-05-23
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Granted: —
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Expires: 2015-05-23
Abstract
Abstract In a method of manufacturing a semiconductor device including a semiconductor element and a chip carrier which has conductive leads bonded to the semiconductor element, a first resin mold portion is formed by a first resin mold portion to locate inner parts of the conductive leads together with the semiconductor element within the first resin mold portion. Thereafter, a second resin mold portion is formed to cover the first resin mold portion on a side of the semiconductor element and to uncover the first resin mold portion on another side opposite to the semiconductor element. Alternatively, a heat spreader may be attached to the semiconductor element and may be sealed by the first and the second resin mold portions.
Inventors
- 👤 Hirofumi C/O Nec Corporation Nakajima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:07
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/01; H10W74/016; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
141 words
A semiconductor device comprising: a chip carrier which has a front surface and a back surface opposite to said front surface and which is formed by a resin substrate and a plurality of leads attached to said resin substrate on said front surface and a semiconductor element having a principal element surface electrically connected to said leads and a bottom element surface opposite to said principal element surface, characterized by: a first mold resin portion which covers said semiconductor element on both sides of said front and said back surfaces of said chip carrier together with a part of said leads adjacent to said semiconductor element to seal said semiconductor element within said first mold resin portion; and a second mold resin portion which covers said first mold resin portion on a side of the back surface of the chip carrier.
Claim 2
Dependent Claim
141 words
A semiconductor device comprising: a chip carrier which has a front surface and a back surface opposite to said front surface and which is formed by a resin substrate and a plurality of leads attached to said resin substrate on said front surface and a semiconductor element having a principal element surface electrically connected to said leads and a bottom element surface opposite to said principal element surface, characterized by: a first mold resin portion which covers said semiconductor element on both sides of said front and said back surfaces of said chip carrier together with a part of said leads adjacent to said semiconductor element to seal said semiconductor element within said first mold resin portion; and a second mold resin portion which covers said first mold resin portion on a side of the back surface of the chip carrier.
Claim 3
Dependent Claim
28 words
A semiconductor device as claimed in claim 1, characterized by: a plurality of balls attached to said leads and projected from said front surface of the chip carrier.
Claim 4
Dependent Claim
62 words
A semiconductor device as claimed in claim 2, characterized in that said first mold resin portion has a first part located on the side of the front surface of the chip carrier and projected from said front surface and a second part located on the side of the back surface of the chip carrier; said balls being higher than said first part.
Claim 5
Dependent Claim
27 words
A semiconductor device as claimed in claim 2, characterized by: a solder mask surrounding said balls on the side of the front surface of the chip carrier.
Claim 6
Dependent Claim
25 words
A semiconductor device as claimed in claim 4, characterized by: another solder mask formed on the side of the back surface of the chip carrier.
Claim 7
Dependent Claim
54 words
A semiconductor device as claimed in claim 1, characterized in that said semiconductor element has the principal element surface directed to said back surface of the chip carrier and a plurality of bumps which are projected from said principal element surface and which are electrically connected direct to said leads of the chip carrier.
Claim 8
Dependent Claim
28 words
A semiconductor device as claimed in claim 6, characterized by: a heat spreader which has a spreader surface attached to said bottom element surface of the semiconductor element.
Claim 9
Dependent Claim
31 words
A semiconductor device as claimed in claim 7, characterized in that said heat spreader has a spreader side surface which is contiguous to said spreader surface and which has a protrusion.
Claim 10
Dependent Claim
34 words
A semiconductor device as claimed in claim 1, characterized in that said chip carrier further has a plurality of additional leads electrically connected to said leads through via holes formed in the resin substrate.
Claim 11
Dependent Claim
19 words
A semiconductor device as claimed in claim 1, characterized in that said first mold resin portion has no fin.
Claim 12
Dependent Claim
77 words
A semiconductor device as claimed in claim 1, characterized in that said resin substrate has a device hole surrounding said semiconductor element while said leads are divisible into inner leads extended within said device hole on said front surface and outer leads laid on said resin substrate and contiguous to said inner leads; said first mold resin portion sealing at least said inner leads on said front and said back surfaces in addition to said semiconductor element.
Claim 13
Dependent Claim
24 words
A semiconductor element as claimed in claim 11, characterized in that said second mold resin portion seals said outer leads on the back surface.
Claim 14
Independent Claim
67 words
A method of manufacturing a semiconductor device which comprises a chip carrier and a semiconductor element mounted on said chip carrier, characterized by the steps of: sealing said semiconductor element by a mold resin to form a first mold resin portion; and sealing a part of said first resin portion by another mold resin to form a second mold resin portion and to obtain said semiconductor device.
Claim 15
Independent Claim
67 words
A method of manufacturing a semiconductor device which comprises a chip carrier and a semiconductor element mounted on said chip carrier, characterized by the steps of: sealing said semiconductor element by a mold resin to form a first mold resin portion; and sealing a part of said first resin portion by another mold resin to form a second mold resin portion and to obtain said semiconductor device.
Claim 16
Dependent Claim
109 words
A method as claimed in claim 13, said chip carrier having a front surface and a back surface opposite to said front surface and comprising a resin substrate and a plurality of leads attached to said resin substrate on said front surface while said semiconductor element mounted on said back surface of the chip carrier and electrically connected to said leads, wherein said first mold resin portion partially seals said leads on both sides of the front and the back surfaces of the chip carrier in addition to said semiconductor element; said second mold resin portion sealing the first mold resin portion on the side of the back surface.
References Cited (Backward Citations)
US5216278A
Cited
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