EP0677985A1
Expired / Lapsed
EP
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Method of manufacturing printed circuit boards
Assignee: Hewlett Packard GmbH Germany
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Filing: 1994-04-14
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Granted: —
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Expires: 2014-04-14
Abstract
Abstract A method of manufacturing printed circuit boards starts from a dielectric substrate (1) wherein recesses (2,3,4,5) according to a desired pattern of conductor structures and through-holes (2a) are produced by laser ablation. Thereafter, a layer (7) of conductive material is deposited on substantially the entire surface of the substrate, for example by physical vapor deposition. A further metal layer (8) is deposited thereon and then the conductive material is removed from the substrate outside the desired pattern of conductor structures and/or holes by a grinding or polishing step. The invention ensures a high density of the conductor structures and does not require photolithographic process steps.
Inventors
- 👤 Wilhelm Tamm
- 👤 Siegfried Dippon
- 👤 Walter Olbrich
- 👤 Michael Weitmann
- 👤 Si-Ty Lam
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 00:28
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/02; B23K26/06; B23K26/067; B23K26/0673; B23K26/04; H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/045; H05K3/10; H05K3/107; H05K3/18; H05K3/188; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0329; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2203/00; H05K2203/02; H05K2203/025; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/0026; H05K3/0032; H05K3/105; H05K3/108; H05K3/38; H05K3/388; H05K3/40; H05K3/42; H05K3/425; H05K3/426; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49131; Y10T29/49155; Y10T29/49156; Y10T29/49165
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
72 words
A method of manufacturing printed circuit boards, comprising the following steps: a) producing recesses (3,4,5) and/or holes (2,2a) in a carrier substrate (1) of isolating material by laser ablation, said recesses corresponding to a desired pattern of conductor structures and/or holes, b) deposition of conductive material (7) on substantially the entire surface of the substrate, and c) removing conductive material from the substrate outside the desired pattern of conductor structures and/or holes.
Claim 2
Dependent Claim
33 words
Method as in claim 1, wherein the laser ablation (step a) comprises irradiating the substrate by an excimer laser (41) for a time sufficient to produce a predetermined depth of the recesses (3,4,5).
Claim 3
Dependent Claim
23 words
Method as in claim 1 or 2, wherein the deposition of conductive material on the substrate (step b) ) comprises physical vapor deposition.
Claim 4
Dependent Claim
36 words
Method as in any of the claims 1 to 3, wherein after step b) and before step c) the following step b2) is performed: b2) depositing conductive material on the metal layer produced by step b).
Claim 5
Dependent Claim
13 words
Method as in claim 4, wherein step b2) comprises a step of electroplating.
Claim 6
Dependent Claim
30 words
Method as in any of the preceding claims, wherein the step of removing conductive material from the substrate (step c)) comprises a step of grinding the surface of the substrate.
Claim 7
Dependent Claim
16 words
Method as in any of the preceding claims, wherein the carrier substrate is a dielectric foil.
Claim 8
Dependent Claim
37 words
Method as in claim 1, wherein the carrier substrate comprises at least two dielectric foils (20,21) of different materials laminated to each other and wherein the recesses are produced substantially only in one of the two foils.
Claim 9
Dependent Claim
16 words
Method as in any of the preceding claims wherein step b) comprises a step of sputtering.
Claim 10
Dependent Claim
29 words
Method as in any of the preceding claims, wherein step a) comprises transmitting a laser beam through a mask corresponding to the desired pattern of conductor structures and/or holes.
Claim 11
Dependent Claim
45 words
Method as in any of the claims 1 to 10, wherein step a) comprises transmitting a laser beam through an adaptive optical system having a plurality of adjustable reflecting elements (47a, 47b, 47c) for directing individual rays of the laser beam to the substrate (40).
Claim 12
Independent Claim
67 words
A method of manufacturing printed circuit boards, comprising the following steps: a) producing recesses and/or holes in a carrier substrate of isolating material by laser ablation, said recesses corresponding to a desired pattern of conductor structures and/or holes, wherein the carrier substrate comprises a material which becomes conductive when irradiated with light, b) deposition of conductive material only in the recesses and/or holes produced in step a).
References Cited (Backward Citations)
FR2394228A1
Cited
US4651417A
Cited
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