Patent US3301349A successfully refreshed from Google Patents.
Patent EP0660399A2 successfully refreshed from Google Patents.
EP0660399A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Ball-grid-array integrated circuit package with thermal conductivity
Assignee: STMicroelectronics lnc USA
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Filing: 1994-11-21
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Granted: —
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Expires: 2014-11-21
Abstract
Abstract An integrated circuit package with a path of high thermal conductivity is disclosed. The package is formed into a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed to receive a thermally conductive slug, formed of a material such as copper. An integrated circuit chip is mounted to one side of the slug, and the opposing surface of the slug is exposed at the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to the underside of the substrate and of the slug in ball-grid-array fashion, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.
Inventors
- 👤 Michael J. Hundt
- 👤 Robert H. Bond
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 19:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10969; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0465; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W74/131; H10W74/142; H10W90/731; H10W90/737; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
137 words
A packaged integrated circuit, comprising: a substrate having first and second surfaces, having a opening disposed therethrough, and having a plurality of electrical conductors; a slug, comprised of a thermally conductive material and having first and second surfaces, said slug extending through the opening of said substrate so that its first surface is exposed at said first surface of said substrate; an integrated circuit chip, mounted to the second surface of said slug, and electrically connected to the conductors of said substrate; a plurality of electrical connectors, disposed at the first surface of said substrate, and in electrical connection with the conductors of said substrate, said plurality of electrical connectors for making connection to a circuit board; and a thermal conductor, disposed at the first surface of said slug, for making thermal connection to the circuit board.
Claim 2
Dependent Claim
19 words
The packaged integrated circuit of claim 1, wherein said plurality of electrical connectors comprise a plurality of solder balls.
Claim 3
Dependent Claim
17 words
The packaged integrated circuit of claim 2, wherein said thermal conductor comprises a plurality of solder balls.
Claim 4
Dependent Claim
28 words
The packaged integrated circuit of claim 1, further comprising: an encapsulant, disposed over said integrated circuit chip and over a portion of the second surface of said substrate.
Claim 5
Dependent Claim
13 words
The packaged integrated circuit of claim 4, wherein said encapsulant comprises molded plastic.
Claim 6
Dependent Claim
15 words
The packaged integrated circuit of claim 1, wherein said substrate comprises a printed circuit board.
Claim 7
Dependent Claim
17 words
The packaged integrated circuit of claim 6, wherein said printed circuit board is of the multilayer type.
Claim 8
Dependent Claim
14 words
The packaged integrated circuit of claim 1, wherein said substrate comprises a ceramic substrate.
Claim 9
Dependent Claim
16 words
The packaged integrated circuit of claim 8, wherein said ceramic substrate is of the multilayer type.
Claim 10
Dependent Claim
12 words
The packaged integrated circuit of claim 1, wherein said slug comprises copper.
Claim 11
Dependent Claim
26 words
The packaged integrated circuit of claim 1, wherein the first surface of said slug has a surface area greater than the second surface of said slug.
Claim 12
Independent Claim
87 words
A method of fabricating a packaged integrated circuit, comprising: inserting a thermally conductive slug into a substrate having first and second opposing surfaces, said thermally conductive slug having a first surface exposed at the first surface of the substrate, and having a second surface opposite therefrom; mounting an integrated circuit chip to the second surface of the thermally conductive slug; encapsulating said integrated circuit chip; attaching electrical connectors to the substrate at its first surface; and attaching a thermal conductor to the slug at its first surface.
Claim 13
Dependent Claim
26 words
The method of claim 12, wherein the step of attaching electrical connectors to the substrate comprises attaching solder balls to the substrate at its first surface.
Claim 14
Dependent Claim
27 words
The method of claim 13, wherein the step of attaching a thermal conductor to the slug comprises attaching solder balls to the slug at its first surface.
Claim 15
Dependent Claim
19 words
The method of claim 12, wherein the encapsulating step comprises: transfer molding a plastic mold compound over said chip.
Claim 16
Dependent Claim
21 words
The method of claim 12, wherein the encapsulating step comprises: dispensing a plastic over said chip; and curing the dispensed plastic.
Claim 17
Dependent Claim
54 words
The method of claim 12, wherein the step of attaching electrical connectors to the substrate and the step of attaching a thermal conductor to the slug comprise attaching solder balls to the substrate and to the slug at their respective first surfaces; and further comprising: attaching the packaged integrated circuit to a circuit board.
References Cited (Backward Citations)
No citation records indexed.
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