Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
116 words
An intelligent test line system comprising: process means (11) for processing a wafer; evaluating means (12) for evaluating a plurality of IC chips on the wafer; control means (13) for setting a burn-in condition and a test condition for each wafer on the basis of primary information obtained by said process means and secondary information obtained by said evaluating means; assembly means (16) for forming an IC product from each IC chip; burn-in means (14) for conducting a burn-in test on the IC chip on the wafer or the IC product under the burn-in condition; and test means (15) for testing the IC chip or the IC product after the burn-in test under the test condition.
Claim 2
Dependent Claim
51 words
A system according to claim 1, characterized in that said control means (13) for setting a stress condition for each wafer on the basis of the primary information and the secondary information, and applies a stress of a predetermined temperature and a predetermined voltage to each wafer under the stress condition.
Claim 3
Dependent Claim
108 words
A system according to claim 1, characterized in that the primary information includes information about formation of a film, information about etching, information about cleaning, information about heat treatment, and information about a test, the secondary information includes information about an yield, information about defect categories, information about mapping, and information about a repair yield, and said control means (13) classifies the wafers into a plurality of quality ranks, determines burn-in conditions, low-temperature test conditions, and high-temperature conditions on the basis of the quality ranks, and supplies the burn-in conditions, the low-test conditions, and the high-test conditions, as tertiary information, to said burn-in means or said test means.
Claim 4
Dependent Claim
66 words
A system according to claim 3, characterized in that said control means (13) classifies the wafers into first, second, and third quality grades on the basis of the primary information, the secondary information, and the first and second quality grades, respectively, determines the tertiary information on the basis of the tertiary information, and supplies supplying the tertiary information to said burn-in means or said test means.
Claim 5
Dependent Claim
58 words
A system according to claim 1, characterized in that said control means (13) classifies the wafers into a plurality of quality ranks on the basis of information about formation of a film, information about etching, information about cleaning, information about heat treatment, and information about a test, and determines test conditions on the basis of the quality ranks.