Form-in-place EMI gaskets

Claim 2

The gasket of claim 1, wherein the silicone resin is a silicone gel.

Claim 3

An EMI gasket comprising a composition formed of: a) a first component which is a primary polymer having end groups that are capable of chemically reacting with each other in the presence of moisture to form a derivative polymer having a longer average chain length than said primary polymer; b) a second component which is a noncross-linked elastomer that is not substantially chemically reactive with itself or with said first component; and c) a third component which is one or more electrically conductive fillers, wherein when said first, said second, said third components are intimately mixed, said composition, when maintained in the absence of moisture and other active hydrogen donor materials, being readily extrudable and otherwise conventionally moldable thermoplastic composition but, upon exposure to moisture, becoming essentially thermoset.

Claim 4

The gasket of claim 3, wherein the first component has a polyester backbone and isocyanate or trialkyoxysilyl end groups, and the second component is selected from the group consisting of a styrene-isoprene-styrene block polymer, a styrene-butadiene-styrene block polymer, an isoprene homopolymer, a polyvinyl chloride, polyisobutylene, styrene-ethylene-butylene-styrene, or ethylene-propylene rubber and the third component is selected from the group consisting of noble metal fillers; noble metal-plated noble metals; noble metal-plated non-noble metals; noble-metal plated glass, plastic or ceramics noble-metal plated mica; non-noble metals, non-noble metal-plated non-noble metals; and non-metal materials such as carbon black and graphite and combinations thereof.

Claim 5

Apparatus for forming EMI shielded enclosures comprising: a) a support platform; b) a compound applicator nozzle located above and in register with the platform; c) a supply of electrically conductive compound connected to the applicator nozzle; and d) a drive mechanism for moving the nozzle or platform relative to each other in one or more directions of travel.

Claim 6

The apparatus of claim 5, further comprising a second drive mechanism.

Claim 7

The apparatus of claim 5 or 6, further comprising a curing chamber for curing of the compound after application.

Claim 8

The apparatus of claim 7 wherein the chamber is selected from the group consisting of hot air ovens, infrared ovens, light chambers, moisture chambers or combinations thereof.

Claim 10

A process for forming a form-in-place conductive EMI shielding gasket or a substrate comprising the steps of: a) providing a substrate to be gasketed; b) providing a supply of conductive gasket material; c) applying the material to a surface of the substrate in a predetermined pattern; and d) curing the material in place upon the substrate.

Claim 11

The process of claim 10 further comprising applying a primer to the substrate before step c).

Claim 12

The process of claim 10, wherein the gasketing material is formed of a conductive filled resin, the resin being selected from the group consisting of silicone, urethanes, thermoplastic elastomers and mixtures thereof; the fillers being selected from the group consisting of noble metal fillers; noble black and graphite and combinations thereof; and the substrate is an electrically conductive material selected from the group consisting of metals, metal composites, metal coated plastics and metal laminates.

Claim 13

The process of any one of claims 10 to 12, wherein the curing occurs via a curing agent, a crosslinking agent, heat, light, moisture or combinations thereof.