Patent EP0638931A2 successfully refreshed from Google Patents.
EP0638931A2
Expired / Lapsed
EP
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Multi-chip module
Assignee: Fujitsu Ltd
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Filing: 1994-04-29
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Granted: —
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Expires: 2014-04-29
Abstract
Abstract A multi-chip module includes a base board (30), a thin-film multi-layer circuit board (32) which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements (32A-5) mounted on a main surface of the thin-film multi-layer circuit board, and terminals (34) which are attached to the main surface of the thin-film multilayer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
Inventors
- 👤 Kiyotaka Seyama
- 👤 Shunichi Kikuchi
- 👤 Makoto Sumiyoshi
- 👤 Naoki Yasuda
- 👤 Minoru Hirano
- 👤 Hitoshi Nori
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:15
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W90/701; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368; H05K3/46; H05K3/4644; H05K3/467; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/60; H10W74/00; H10W90/20; H10W90/22; H10W90/288; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
89 words
A multi-chip module comprising: a base board (30); a thin-film multi-layer circuit board (32) which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked; circuit elements (32A-5) mounted on a main surface of the thin-film multi-layer circuit board; and terminals (34) which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
Claim 2
Dependent Claim
16 words
The multi-chip module as claimed in claim 1, characterized in that said terminals comprise lead members.
Claim 3
Dependent Claim
16 words
The multi-chip module as claimed in claim 1, characterized in that said terminals comprise leadless members.
Claim 4
Dependent Claim
43 words
The multi-chip module as claimed in claim 1, 2 or 3, characterized in that said terminals are soldered to wiring conductors of the thin-film multilayer circuit board facing the wiring board, so that the terminals are supported by the thin-film multilayer circuit board.
Claim 5
Dependent Claim
36 words
The multi-chip module as claimed in any of claims 1 to 4, characterized in that wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.
Claim 6
Dependent Claim
29 words
The multi-chip module as claimed in claim 2, characterized in that said lead members comprise lead pins vertically extending from the main surface of the thin-film multi-layer circuit board.
Claim 7
Dependent Claim
18 words
The multi-chip module as claimed in claim 2, characterized in that said lead members comprise flat-type lead pins.
Claim 8
Dependent Claim
17 words
The multi-chip module as claimed in claim 2, characterized in that said lead members comprise wire leads.
Claim 9
Dependent Claim
18 words
The multi-chip module as claimed in claim 2, characterized in that said lead members comprise tape-automated bonding leads.
Claim 10
Dependent Claim
40 words
The multi-chip module as claimed in any of claims 1 to 5, characterized in that said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 11
Dependent Claim
39 words
The multi-chip module as claimed in any of claims 1 to 5 or claim 10, characterized by further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 12
Dependent Claim
47 words
The multi-chip module as claimed in any of claims 1 to 5 or claims 10 or 11, characterized by further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
References Cited (Backward Citations)
No citation records indexed.
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