Patent EP0637871A1 successfully refreshed from Google Patents.
EP0637871A1
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EP
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Surface acoustic wave device mounted module
Assignee: Panasonic Holdings Corp
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Filing: 1994-08-02
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Granted: —
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Expires: 2014-08-02
Abstract
Abstract This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate 8 which has at least one layer of a shield pattern 12, input-output electrodes 10, grounding electrodes 11, via holes 9 used for connecting electrodes, and a surface acoustic wave element 1. The surface acoustic wave element has metallic bumps 5, which are transfer-coated with a conductive resin 6, on electrode pads; an insulating resin 7 around the surface acoustic wave element; and an inter-digital transducer 4. The electrode pads are input-output terminals 2 and grounding terminals 3 formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the via holes. An electrode pattern 14 is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid 13 is attached to the electrode pattern by a solder or conductive resin 15 so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the via holes.
Inventors
- 👤 Keiji Onishi
- 👤 Shunichi Seki
- 👤 Yutaka Taguchi
- 👤 Kazuo Eda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 23:55
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H9/1071; H03H9/0538; H03H9/0542; H03H9/0547; H03H9/0557; H03H9/058; H03H9/059; H03H9/1085; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W72/00; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
186 words
A surface acoustic wave device mounted module, comprising: a multilayer substrate comprising at least one layer of shield pattern, input-output electrodes, grounding electrodes and via holes used for connecting electrodes; and a surface acoustic wave element placing an inter-digital transducer to face said multilayer substrate, said surface acoustic wave element having metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin disposed around said surface acoustic wave element; wherein said electrode pads are input-output terminals and grounding terminals formed on said surface acoustic wave element; wherein continuities between said input-output terminals and said input-output electrodes, and between said grounding terminals and said grounding electrodes are established by said via holes; wherein an electrode pattern is formed on a surface of said multilayer substrate facing and surrounding said surface acoustic wave element; wherein a metallic lid is attached to said electrode pattern by a solder or a conductive resin so that said surface acoustic wave element is sealed in an airtight condition by said metallic lid; and wherein said electrode pattern is connected to said grounding electrodes by said via holes.
Claim 2
Dependent Claim
45 words
The surface acoustic wave device mounted module according to claim 1, wherein the surface acoustic wave element is a piezoelectric substrate, and wherein said piezoelectric substrate is at least one material selected from the group consisting of lithium tantalate, lithium niobate, lithium borate and quartz.
Claim 3
Dependent Claim
51 words
The surface acoustic wave device mounted module according to claim 1 or 2, wherein the multilayer substrate comprises an electrode pattern on its surface facing an inter-digital transducer of the surface acoustic wave element, said electrode pattern having continuity with the grounding electrodes or the shield pattern by the via holes.
Claim 4
Dependent Claim
49 words
The surface acoustic wave device mounted module according to any of claims 1 to 3, wherein the surface acoustic wave element comprises a conductive film on a surface opposite a surface facing the multilayer substrate to establish continuity between the metallic lid and said surface by said conductive film.
Claim 5
Dependent Claim
42 words
The surface acoustic wave device mounted module according to any of claims 1 to 4, wherein the metallic lid has a continuity with a surface of the surface acoustic wave element opposite a surface facing the multilayer substrate by a conductive resin.
Claim 6
Dependent Claim
34 words
The surface acoustic wave device mounted module according to any of claims 1 to 5, wherein the bumps are made of at least one metal selected from the group consisting of gold and aluminum.
Claim 7
Dependent Claim
31 words
The surface acoustic wave device mounted module according to any of claims 1 to 6, wherein the surface acoustic wave element is mounted on a flat surface of the multilayer substrate.
Claim 8
Dependent Claim
31 words
The surface acoustic wave device mounted module according to any of claims 1 to 7, wherein the surface acoustic wave element is mounted in a depression formed in the multilayer substrate.
Claim 9
Dependent Claim
31 words
The surface acoustic wave device mounted module according to any of claims 1 to 8, wherein the multilayer substrate comprises a circuit element to match input-output impedances of an outside circuit.
Claim 10
Dependent Claim
183 words
A surface acoustic wave device mounted module, comprising; a multilayer substrate comprising at least one layer of shield pattern, input-output electrodes, grounding electrodes and via holes for connecting electrodes; a surface acoustic wave element comprising an inter-digital transducer facing said multilayer substrate, said surface acoustic wave element having metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin partially or entirely disposed around said surface acoustic wave element; and active components or passive components; wherein said electrode pads are input-output terminals and grounding terminals formed on said surface acoustic wave element; wherein said surface acoustic wave element and said active components or passive components are integrated into one body on said multilayer substrate; wherein an electrode pattern is formed on said multilayer substrate to surround said surface acoustic wave element; wherein a metallic lid is formed on said electrode pattern by a solder or a conductive resin to seal said surface acoustic wave element in an airtight condition by said metallic lid; and wherein said electrode pattern is connected to said grounding electrodes by said via holes.
Claim 11
Dependent Claim
26 words
The surface acoustic wave device mounted module according to claim 10, wherein the surface acoustic wave element is mounted in a depression of the multilayer substrate.
Claim 12
Dependent Claim
42 words
The surface acoustic wave device mounted module according to claim 10 or 11, wherein the electrode pattern is formed on the multilayer substrate so as to surround the surface acoustic wave element and the active components or passive components in one body.
Claim 13
Dependent Claim
34 words
The surface acoustic wave device mounted module according to any of claims 10 to 12, wherein the bumps are made of at least one metal selected from the group consisting of gold and aluminum.
References Cited (Backward Citations)
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