Patent US6648817B2 successfully refreshed from Google Patents.
Patent EP0632511A2 successfully refreshed from Google Patents.
EP0632511A2
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EP
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A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module
Assignee: Mitsubishi Cable Industries Ltd
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Filing: 1994-06-28
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Granted: —
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Expires: 2014-06-28
Abstract
Abstract A light emitting diode aggregate module comprises a metallic base printed circuit board (1), light emitting diode chips (2) each of which is mounted on a bottom section of each hollow section (23) formed on the metallic base printed circuit board (1), electronic parts (3) which are mounted on the metallic base printed circuit board (1) and outside of the hollow sections (23), bonding wires (5b) each of which interconnects the light emitting diode (2) and each land section (5) which is formed in the hollow section (23), soft resin layers (6) each of which covers corresponding light emitting diode chip (2) and corresponding bonding wire (5b), and a lens board (20) which is formed in one body on the matallic base printed circuit board (1) by insert molding of translucent resin and has lens sections (20a) each of which corresponds to each light emitting diode chip (2).
Inventors
- 👤 Shinichi C/O Itami Factory Of Sano
- 👤 Hiroaki C/O Tokyo Office Of Mitsubishi Murata
- 👤 Atsushi C/O Minosima Factory Of Ohhori
- 👤 Takeo C/O Minosima Factory Of Futagami
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 22:43
CPC Classifications
H; H10; H10W; H10W90/00; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; H10H20/855; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
211 words
A light emitting diode aggregate module in which lenses (20a) formed with translucent resin are disposed on a surface of a printed circuit board (1) on which plural light emitting diode chips (2) are mounted, each of the lenses (20a) corresponding to each light emitting diode chip (2), the light emitting diode aggregate module being characterized in comprising; a metallic base printed circuit board (1) having plural hollows (23) thereon, a predetermined printed pattern, light emitting diode chips (2) each mounted in a bottom portion of each hollow (23), and electronic parts (3) each mounted at a location which is different from a mounted location of the light emitting diode chip (2), a soft resin layer (6) for surrounding peripheral portion of the light emitting diode chip (2), a protection layer (3a) made of resin for covering a part or entirety of the electronic parts (3), and a lens board (20) which is formed by injection of translucent resin into a die and is disposed in contact on a surface of the printed circuit board (1), the lens board (20) covering the plural light emitting diode chips (2) and the electronic parts (3), and having lens sections (20a) projecting forward at a location corresponding to each light emitting diode chip (2).
Claim 2
Dependent Claim
211 words
A light emitting diode aggregate module in which lenses (20a) formed with translucent resin are disposed on a surface of a printed circuit board (1) on which plural light emitting diode chips (2) are mounted, each of the lenses (20a) corresponding to each light emitting diode chip (2), the light emitting diode aggregate module being characterized in comprising; a metallic base printed circuit board (1) having plural hollows (23) thereon, a predetermined printed pattern, light emitting diode chips (2) each mounted in a bottom portion of each hollow (23), and electronic parts (3) each mounted at a location which is different from a mounted location of the light emitting diode chip (2), a soft resin layer (6) for surrounding peripheral portion of the light emitting diode chip (2), a protection layer (3a) made of resin for covering a part or entirety of the electronic parts (3), and a lens board (20) which is formed by injection of translucent resin into a die and is disposed in contact on a surface of the printed circuit board (1), the lens board (20) covering the plural light emitting diode chips (2) and the electronic parts (3), and having lens sections (20a) projecting forward at a location corresponding to each light emitting diode chip (2).
Claim 3
Dependent Claim
69 words
A light emitting diode aggregate module as set forth in claim 1, wherein the printed circuit board (1) has a rectangular shape, and further comprises claw sections (21)(21a) which are formed in one body at edge sections excluding corner sections (22) of the lens board (20) so that fixation of the printed circuit board (1) and the lens board (20) is performed by the claw sections (21 )(21 a).
Claim 4
Dependent Claim
65 words
A light emitting diode aggregate module as set forth in claim 1 or 2, further comprising through holes (11) in the printed circuit board (1) so that fixation of the printed circuit board (1) and the lens board (20) is performed by going round the resin for lens board to an opposite face side of the printed circuit board (1) through the through holes (11).
Claim 5
Dependent Claim
45 words
A light emitting diode aggregate module as set forth in claim 3, wherein the through holes (11) are provided in vicinity of the light emitting diode mounting portion, and the light emitting diode (2) is substantially surrounded with the resin for the lens board (20).
Claim 6
Dependent Claim
56 words
A light emitting diode aggregate module as set forth in one of claims 1 to 4, wherein the protection layer (3a) for the electronic parts (3) is formed in a shape which reduces resistance against the flowing of the translucent resin for lens board (20) when the translucent resin is injected in a molding die (4).
Claim 7
Dependent Claim
90 words
A light emitting diode aggregate module as set forth in one of claims 1 to 5, further comprising a printed circuit (5a) and land sections (5) formed on the printed circuit board (1), and wherein the printed circuit (5a) extending from the land section (5) among the printed circuit on the printed circuit board (1), is provided in a direction of flowing of the translucent resin when the translucent resin is injected in a molding die (4), the land section (5) being electrically connected the electronic parts (3) at least.
Claim 8
Dependent Claim
69 words
A light emitting diode aggregate module as set forth in one of claims 1 to 6, further comprising a soft resin layer (6) for covering peripheral portion of the light emitting diode chip (2), the soft resin layer (6) being housed in the hollow (23) so as to make a surface of the soft resin layer (6) flat and coincident with the surface of the printed circuit board (1).
Claim 9
Dependent Claim
33 words
A light emitting diode aggregate module as set forth in one of claims 1 to 7, further comprising a step section (23a) which is provided in a predetermined location of each hollow (23).
Claim 10
Dependent Claim
118 words
A light emitting diode aggregate module as set forth in one of claims 1 to 8, wherein the land section (5) on the printed circuit board (1) is connected to an upper electrode of the light emitting diode chip (2) by a bonding wire (5b), extending directions of the bonding wire (5b) with respect to the light emitting diode chip (2) are determined at least two directions, a number of the bonding wires (5b) extending in each direction is determined nearly equal to one another, for preventing the light emitting diode aggregate module from not obtaining sufficient plane luminance characteristics caused by screening of light radiated from the light emitting diode chips (2) by the bonding wires (5b).
Claim 11
Independent Claim
172 words
A method for manufacturing a light emitting diode aggregate module in which lenses (20a) formed with translucent resin are disposed on a surface of a printed circuit board (1) on which plural light emitting diode chips (2) are mounted, each of the lenses (20a) corresponding to each light emitting diode chip (2), the method being characterized in comprising the steps of; a step for housing a printed circuit board (1) on which light emitting diode chips (2) are mounted in a molding die (4) which has plural cavities (4c) for lens corresponding to a front face side of the printed circuit board (1), and a step for injecting translucent resin for lens board in the molding die (4) through one or more injection gates (17) and runners (17b) which are provided in the molding die (4) so that the translucent resin once collides against the front face of the printed circuit board (1), then the translucent resin flows into the cavities (4c) along the front face of the printed circuit board (1).
Claim 12
Independent Claim
172 words
A method for manufacturing a light emitting diode aggregate module in which lenses (20a) formed with translucent resin are disposed on a surface of a printed circuit board (1) on which plural light emitting diode chips (2) are mounted, each of the lenses (20a) corresponding to each light emitting diode chip (2), the method being characterized in comprising the steps of; a step for housing a printed circuit board (1) on which light emitting diode chips (2) are mounted in a molding die (4) which has plural cavities (4c) for lens corresponding to a front face side of the printed circuit board (1), and a step for injecting translucent resin for lens board in the molding die (4) through one or more injection gates (17) and runners (17b) which are provided in the molding die (4) so that the translucent resin once collides against the front face of the printed circuit board (1), then the translucent resin flows into the cavities (4c) along the front face of the printed circuit board (1).
Claim 13
Dependent Claim
198 words
A method as set forth in claim 10, further comprising a step for forming through holes (11) in the printed circuit board (1) at locations each of which is near the mounted section of each light emitting diode chip (2), and is opposite to each cavity (4c) for lens, and wherein the step for housing the printed circuit board (1) in the molding die (4) is a step for housing the printed circuit board (1) on which the light emitting diode chips (2) are mounted in the molding die (4) which has the plural cavities (4c) for lens corresponding to the front face side of the printed circuit board (1) and plural cavities (4d) for fixing lens corresponding to rear face side of the printed circuit board (1), each of the cavities (4d) facing to corresponding cavity (4c) for lens, and the step for injecting the translucent resin for lens board is a step for injecting the translucent resin for lens board to flow into the cavities (4c) for lens and for injecting the translucent resin for lens board to flow into the cavities (4d) for fixing lens through the cavities (4c) for lens and the through holes(11).
Claim 14
Dependent Claim
52 words
A method as set forth in claim 10 or 11, further comprising a step for forming protection layers (6) made of soft resin on the surface of light emitting diode chips (2) mounted on the printed circuit board (1) prior to housing the printed circuit board (1) in the molding die (4).
Claim 15
Independent Claim
50 words
A method as set forth in one of claims 10 to 12, further comprising a step for forming plural hollow sections (23) on the printed circuit board (1), and a step for mounting each of the light emitting diode chips (2) on a bottom portion of each hollow section (23).
Claim 16
Independent Claim
34 words
A method as set forth in one of claims 10 to 13, further comprising a step for forming step sections (23a), each of which being in a predetermined location of each hollow section (23).
Claim 17
Independent Claim
46 words
A method as set forth in one of claims 10 to 14, further comprising a step for mounting electronic parts (3) on the printed circuit board (1), and a step for covering a part or entirety of each mounted electronic parts (3) with a protection layer
Claim 18
Independent Claim
112 words
A method as set forth in one of claims 10 to 15, further comprising a step for mounting light emitting diode chips (2) on the printed circuit board (1) in an arranged in matrix pattern condition, and wherein plural injection gates (17) are formed in the molding die (4), a number of injection gates (17) corresponding to a mounted number of the light emitting diode chips (2) and each injection gate (17) being located at nearly central position of more than two mounted light emitting diode chips (2) on the front face of the printed circuit board (1), and the translucent resin for lens is injected from each injection gate (17), respectively.
Claim 19
Independent Claim
54 words
A method as set forth in one of claims 10 to 16, further comprising a step for forming a soft resin layer (6) which covers all surface of each light emitting diode chip (2), and surface of which is determined to be flat and coincident with the surface of the printed circuit board (1).
References Cited (Backward Citations)
No citation records indexed.
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