Patent EP0620592A1 successfully refreshed from Google Patents.
EP0620592A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Integrated circuit package
Assignee: Fujitsu Ltd
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Filing: 1993-09-03
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Granted: —
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Expires: 2013-09-03
Abstract
Abstract The integrated circuit package comprises a package body, an integrated circuit chip enclosed airtight in the package body, a lead provided at a lower portion of the package body for connecting the integrated circuit chip to an external circuit, and air blasting means for cooling the package body by forced air cooling. The package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which the air blasting means is disposed, and a ventilation flue is formed between the heat radiation region and the air blasting region. This package is particularly superior in heat radiation property.
Inventors
- 👤 Tadashi C/O Fujitsu Limited Katsui
- 👤 Katsuhiko C/O Fujitsu Limited Nakata
- 👤 Takashi C/O Pfu Limited Kitahara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 14:53
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; H10W40/70; H10W40/73; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
99 words
An integrated circuit package comprising: a package body; an integrated circuit chip enclosed airtight in said package body; a lead provided at a lower portion of said package body for connecting said integrated circuit chip to an external circuit; and air blasting means for cooling said package body by forced air cooling; wherein said package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which said air blasting means is disposed; wherein a ventilation flue is formed between said heat radiation region and said air blasting region.
Claim 2
Dependent Claim
52 words
An integrated circuit package according to claim 1, wherein said air blasting means comprises a fan assembly which includes a motor having a rotary shaft in a thicknesswise direction of said package body, a propeller connected to said rotary shaft of said motor, and a driver circuit section for driving said motor.
Claim 3
Dependent Claim
18 words
An integrated circuit package according to claim 2, wherein said fan assembly is secured to said package body.
Claim 4
Dependent Claim
45 words
An integrated circuit package according to claim 2, further comprising a cover secured to said package body so as to close up the upper portion of said package body; said cover having an opening which communicates with said ventilation flue by way of said propeller.
Claim 5
Dependent Claim
17 words
An integrated circuit package according to claim 4, wherein said fan assembly is secured to said cover.
Claim 6
Dependent Claim
52 words
An integrated circuit package according to claim 4, wherein said cover has an annular projection positioned on a little outer side of a locus of rotation of said propeller; and wherein the difference in static pressure between said opening of said cover and said ventilation flue is increased by said annular projection.
Claim 7
Dependent Claim
37 words
An integrated circuit package according to claim 6, wherein said propeller is rotated so that air may flow from said opening of said cover to the heat radiation portion of said package body through said ventilation flue.
Claim 8
Dependent Claim
37 words
An integrated circuit package according to claim 6, wherein said propeller is rotated so that air may flow from the heat radiation portion of said package body to said opening of said cover through said ventilation flue.
Claim 9
Dependent Claim
27 words
An integrated circuit package according to claim 2, wherein the center of said fan assembly is offset from the center of heat generation of said package body.
Claim 10
Dependent Claim
42 words
An integrated circuit package according to claim 1, wherein a hollow portion is provided between the upper portion of said package body and said integrated circuit chip; and wherein liquid is filled or a heat pipe is embedded in said hollow portion.
Claim 11
Dependent Claim
27 words
An integrated circuit package according to claim 1, wherein said package body is formed from a ceramic body, and said fin is integral with said ceramic body.
Claim 12
Dependent Claim
45 words
An integrated circuit package according to claim 1, wherein said package body has a two-layer structure of a ceramic body and a metal body, and said fin is integral with said metal body while said integrated circuit chip is securely mounted on said metal body.
References Cited (Backward Citations)
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