Patent EP0602298A1 successfully refreshed from Google Patents.
EP0602298A1
Expired / Lapsed
EP
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Process for dissipating heat from a semiconductor package
Assignee: STMicroelectronics SRL
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Filing: 1992-12-15
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Granted: —
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Expires: 2012-12-15
Abstract
Abstract A dam (14) is provided on a surface of a circuit board (10) to which an integrated circuit device (20) is to be mounted. The dam (14) defines a region (16) between the integrated circuit package (20) and the circuit board (10), and a material (24) is injected into this region (16) after the device (20) has been mounted on the circuit board (10). This material (24) preferably is a good thermal conductor, assisting in the removal of heat from the device (20). The injected material (24) also preferably acts as an adhesive, more firmly bonding the device (20) the circuit board (10).
Inventors
- 👤 Carlo Cognetti
- 👤 Michael J. C/O Sgs-Thomson Hundt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 17:39
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/25; H10W40/251; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/0959; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
104 words
A printed circuit board for holding an integrated circuit chip, comprising: a plurality of contact pads on an upper surface for making contact with integrated circuit leads; a dam enclosing a region adjacent to said contact pads, said dam being sized and shaped smaller than the integrated circuit package and having a height substantially the same as a space between the integrated circuit package and the board when the integrated circuit is mounted; and at least one aperture between the enclosed region and an outside location, said aperture suitable for injecting thermally conductive material for filling the region after the integrated circuit is mounted.
Claim 2
Dependent Claim
20 words
The printed circuit board of Claim 1, wherein said aperture extends through the printed circuit board to a lower surface.
Claim 3
Dependent Claim
20 words
The printed circuit board of Claim 1, wherein a single aperture extends between the enclosed region and the outside location.
Claim 4
Dependent Claim
20 words
The printed circuit board of Claim 1, wherein a two apertures extend between the enclosed region and the outside location.
Claim 5
Dependent Claim
18 words
The printed circuit board of Claim 1, wherein said dam is formed integrally with the printed circuit board.
Claim 6
Dependent Claim
24 words
The printed circuit board of Claim 1, further comprising: at least one additional through hole extending from the enclosed region to a metallic conductor.
Claim 7
Dependent Claim
18 words
The printed circuit board of Claim 6, wherein said additional through hole is plated with a metallic conductor.
Claim 8
Dependent Claim
16 words
The printed circuit board of Claim 6, wherein the metallic conductor is a power supply conductor.
Claim 9
Dependent Claim
94 words
A support for an integrated circuit, comprising: a printed circuit board having an upper and a lower surface; a dam on the upper surface defining a region; at least one aperture connecting the region with a location outside the region; a plurality of contact pads on the upper surface and located adjacent the dam; an integrated circuit device having a package resting on said dam, and having a plurality of conductive leads connected to said conductive pads; a material filling the region and contacting the integrated circuit and the printed circuit board upper surface.
Claim 10
Dependent Claim
14 words
The support of Claim 9, wherein the material filling the region comprises an adhesive.
Claim 11
Dependent Claim
13 words
The support of Claim 10, wherein the adhesive is a good thermal conductor.
Claim 12
Dependent Claim
10 words
The support of Claim 11, wherein the adhesive comprises THERMALLOY.
Claim 13
Dependent Claim
16 words
The support of Claim 9, wherein the material filling the region comprises a good thermal conductor.
Claim 14
Dependent Claim
18 words
The support of Claim 9, wherein said aperture extends through the printed circuit board to the lower surface.
Claim 15
Dependent Claim
18 words
The support of Claim 9, wherein a single aperture extends between the enclosed region and the outside location.
Claim 16
Dependent Claim
22 words
The support of Claim 9, further comprising: at least one additional through hole extending from the enclosed region to a metallic conductor.
Claim 17
Dependent Claim
18 words
The printed circuit board of Claim 6, wherein said additional through hole is plated with a metallic conductor.
Claim 18
Independent Claim
51 words
A method for attaching an integrated circuit package to a circuit board, comprising the steps of: bonding the integrated circuit to a circuit board having a dam so as to define a region between the package and the board and surrounded by the dam; and injecting a material into the region.
Claim 19
Dependent Claim
13 words
The method of Claim 18, wherein the injected material is an adhesive material.
Claim 20
Dependent Claim
12 words
The method of Claim 19, wherein the adhesive material is thermally conductive.
Claim 21
Dependent Claim
12 words
The method of Claim 18, wherein the injected material is thermally conductive.
Claim 22
Dependent Claim
23 words
The method of Claim 18, wherein the material is injected through the circuit board from a side opposite a side with the dam.
References Cited (Backward Citations)
US4644445A
Cited
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