Encapsulated light emitting diode and method for encapsulating the same

Claim 2

The optical module of claim 1, characterized in that light emitting diode is a laser diode (20), the light emitting facet (22) thereof being one of the facets defining the cavity of the laser (20).

Claim 3

The optical module of claims 1 or 2, characterized in that said narrow gap (27; 47; 60) has a width between 5 µm and 100 µm.

Claim 4

The optical module of claim 1, characterized in that an optical fiber (42) serves as optical output port, this fiber being aligned with respect to the light emitting portion of the diode such that the optical path starts at said light emitting portion, passes through said gap (47) directly into said optical fiber (42) and leaves the module via said fiber (42).

Claim 5

The optical module of claim 4, characterized in that said fiber (42) is pre-aligned in an alignment support having a v-shaped groove, its main axis being approximately perpendicular to the light emitting facet of the diode (40), said alignment support being part of, or being attached to, said mounting base (43).

Claim 6

The optical module of claim 1, characterized in that an optical lens (57) serves as optical output port, this lens (57) being aligned with respect to the light emitting portion of the diode (60) such that the optical path starts at said light emitting portion, passes through said gap (60) directly into said optical lens (57) and leaves the module via said lens (57).

Claim 7

The optical module of claim 6, characterized in that said lens (57) is situated in a window of a sealing cap (56), the mounting base (51) of the light emitting diode (50) being fixed at a baseplate (52), said sealing cap (56) covering the diode (50) and the mounting base (51), such that the position of said lens (57) with respect to the light emitting portion of the diode (50) is automatically defined.

Claim 8

The optical module of claim 1, characterized in that said encapsulant (24; 45, 46; 60, 61) comprises cyclic alipathic epoxy resin, diglycidyl ester, polyurethan, or polymethyl methacrylate (PMMA).

Claim 9

The optical module of claim 1, characterized in that vacuum conditions are established in said gap (27; 47; 60), or that said gap (27; 47; 60) is filled with an inert gas, such as nitrogen.

Claim 10

Method for the encapsulation of a semiconductor light emitting diode (20; 40; 50), comprising the steps of: a) mounting said diode (20; 40; 50) on a mounting base (23; 43; 51), b) placing a thin foil (28; 44; 55) in front of the light emitting facet of said diode (20; 40; 50), said foil (28; 44; 55) covering at least the light emitting portion of said light emitting facet, c) flowing a first encapsulant (29; 45; 58) over the diode (20; 40; 50) with the foil (28; 44; 55) acting as dam; d) removing said foil (28; 44; 55) after said first encapsulant (29; 45; 58) has hardened, leaving a narrow gap (27; 47; 60) in direct contact with said light emitting facet, e) completing the encapsulation by flowing a second encapsulant (30; 46; 61) over said structure such that the second encapsulant (30; 46; 61) covers the opening of the gap (27; 47; 60) but is not drawn into it.

Claim 11

Method of claim 10, characterized in that said foil (28; 44; 55) is a soluble foil, said foil (28; 44; 55) being removed by employment of a suitable solvent.

Claim 12

Method of claim 10, characterized in that an optical fiber (42) is placed in an alignment support and pressed against said foil (44) prior to step c), the fiber (42) serving as clamp.

Claim 13

Method of claim 10, characterized in that said first encapsulant (29; 45; 58) and/or second encapsulant (30; 46; 61) comprise(s) cyclic alipathic epoxy resin, diglycidyl ester, polyurethan, or polymethyl methacrylate (PMMA).

Claim 14

Method of claim 11, characterized in that step e) is carried out in a well defined environment such as an inert gas atmosphere, e.g. nitrogen, or in a vacuum.