EP0591772A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High-density/long-via laminated connector
Assignee: Fujitsu Ltd
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Filing: 1993-09-23
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Granted: —
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Expires: 2013-09-23
Abstract
Abstract A high-density laminated connector (100) comprises a plurality of layers (114) of rigid dielectric material which are laminated together. The rigid construction of the connector permits precise dimensions of the connector and, thus, accurate attachment of adjacent circuit boards. The dielectric contains traces (108) which are jointed to contact pads (112), connecting the traces to adjacent circuit boards. The contact pads are comprised of soft gold, solder, or various elastomeric materials. The use of soft gold contacts allows the connector to be easily removed from the adjacent circuit board. Alternatively, the rigid dielectric layers (114) contain recesses (314) where the contact pads are placed. This ensures physical alignment of the circuit board and the connector, so that dimensional integrity is maintained when pressure is applied to the connector. The traces within the connector can be of various width, pitch, and direction. Thus, right-angle interconnections can be made. Cross-traces (109, 110) can be placed on each individual layer of dielectric or vias (400) made through the dielectric layers, to interconnect traces. The trace width can be economically and accurately narrowed to produce high-aspect ratios and thus provide high-signal density.
Inventors
- 👤 David A. Horine
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 22:45
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R12/55; H01R12/57
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
71 words
A connector comprising:- a plurality of planar layers of a rigid dielectric material, said layers laminated to form a block; traces provided on said planar layers, at least one trace having an exposed terminal at a first surface of the block; at least one contact pad for establishing a contact between the or each said exposed terminal and a circuit board; and means for interconnection of the traces within the block.
Claim 2
Dependent Claim
26 words
A connector as defined in claim 1, further including means for removably attaching a circuit board to the connector for electrical contact with the contact pad.
Claim 3
Dependent Claim
21 words
A connector as defined in claim 1 or 2, wherein the rigid dielectric has a dielectric constant of less than seven.
Claim 4
Dependent Claim
19 words
A connector as defined in claim 1, 2, or 3, wherein each planar layer carries a plurality of traces.
Claim 5
Dependent Claim
15 words
A connector as defined in claim 4, wherein the traces have varying pitch and width.
Claim 6
Dependent Claim
18 words
A connector as defined in any preceding claim, wherein the traces have an aspect ratio greater than 40.
Claim 7
Dependent Claim
28 words
A connector as defined in any preceding claim, wherein the interconnection means comprises a via extending between the planar layers of the dielectric, said via connecting the traces.
Claim 8
Dependent Claim
28 words
A connector as defined in any preceding claim, wherein the interconnection means comprises a cross-trace on at least one planar layer of dielectric material, said cross-trace connecting traces.
Claim 9
Dependent Claim
21 words
A connector as defined in any preceding claim, wherein the contact pad comprises soft gold, a conductive elastomeric material, or solder.
Claim 10
Dependent Claim
26 words
A connector as defined in any preceding claim, wherein at least one trace has a second terminal on a second surface perpendicular to said first surface.
Claim 11
Dependent Claim
33 words
A connector as defined in claim 10, wherein at least one trace connects to a via which has a third terminal on a third surface perpendicular to said first and said second surfaces.
Claim 12
Dependent Claim
27 words
A connector as defined in any preceding claim, wherein a cross-trace extends to a second surface of the connector perpendicular to the first surface of the connector.
Claim 13
Dependent Claim
30 words
A connector as defined in claim 12, wherein a via extends to a third surface of the connector perpendicular to said first surface and said second surface of the connector.
Claim 14
Dependent Claim
19 words
A connector as defined in any preceding claim, wherein the traces are printed or photolithographically imaged on the layers.
Claim 15
Dependent Claim
30 words
A connector as claimed in any preceding claim, wherein the or each exposed terminal at the first surface of the block is located within a recess in said first surface.
Claim 16
Dependent Claim
20 words
A connector as defined in any preceding claim, wherein the rigid dielectric material is a glass material or glass ceramic.
Claim 17
Dependent Claim
21 words
A connector as defined in any preceding claim, further including mechanical attachment means for attaching the connector to a circuit board.
Claim 18
Dependent Claim
36 words
A connector as defined in claim 17, wherein the mechanical attachment means comprises a screw for insertion through an aperture in the circuit board, and a tapped hole in said connector for removably receiving the screw.
Claim 19
Dependent Claim
41 words
A connector as defined in claim 18 wherein, in use, said screw urges said circuit board into contact with said surface of the connector whereby the contact pad is compressed, thereby creating electrical contact between said terminal and said circuit board.
Claim 20
Independent Claim
75 words
A method of manufacturing a connector, comprising the steps of:- (a) precisely laying out a plurality of traces on a rigid layer of dielectric material; (b) inserting a via through said layer; (c) stacking a plurality of said layers to form a block; (d) laminating together said layers; (e) cutting the block into at least one connector and exposing at least one trace to provide a terminal for establishing electrical contact to a circuit board.
Claim 21
Dependent Claim
23 words
A method as defined in claim 20, wherein step (a) involves any of: photolithography and plating, photolithography and plasma deposition, and image transferring.
Claim 22
Dependent Claim
24 words
A method as defined in claim 20 or 21, wherein step (b) includes drilling a hole and plating and sputtering metal into the hole.
Claim 23
Dependent Claim
24 words
A method as defined in claim 20 or 21, wherein step (b) includes drilling a hole and pasting a conductive material into the hole.
Claim 24
Independent Claim
26 words
A method as defined in any of claims 20 to 23, wherein in step (a) the traces are given an aspect ratio of at least 40.
Claim 25
Independent Claim
29 words
A method as defined in any of claims 20 to 24, wherein step (d) includes pressing together said layers with a hot isostatic press, or diffusion bonding said layers.
Claim 26
Independent Claim
16 words
A method as defined in any of claims 20 to 25, wherein step (e) includes precision-sawing.
Claim 27
Independent Claim
43 words
A method as defined in any of claims 20 to 26, comprising the further step of establishing contact to a circuit board by joining the terminal of the trace to a conductive elastomeric contact, said contact being removably aligned with the circuit board.
References Cited (Backward Citations)
US4770640A
Cited
JPS6293961A
Cited
JPS63292504A
Cited
WO1989004113A1
Cited
JPH0212894A
Cited
JPH0232595A
Cited
JPH0291993A
Cited
US4871316A
Cited
EP0397057A1
Cited
JPH04321258A
Cited
DE4136355A1
Cited
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