Patent US5341305A successfully refreshed from Google Patents.
Patent EP0577484A1 successfully refreshed from Google Patents.
EP0577484A1
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EP
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Method of forming a bond between copper and a non-oxide ceramic substrate for power-electronics
Assignee: Alcatel Lucent SAS
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Filing: 1993-06-25
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Granted: —
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Expires: 2013-06-25
Abstract
Abstract Process for producing a bond between copper and a substrate for power electronics, heat-conductive and electrically insulating made of nonoxide ceramic, the process consisting in oxidising the said substrate superficially and then employing the DBC (direct bond copper) technique, characterised in that the superficial oxidation operation of the said substrate is performed by irradiating the surface concerned with the aid of a laser beam to a thickness of between 0.1 mu m and 3 mu m.
Inventors
- 👤 Roland C/O Alcatel Alsthom Recherche Queriaud
- 👤 Alain Petitbon
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 20:36
CPC Classifications
C; C04; C04B; C04B37/00; C04B37/02; C04B37/021; C04B37/023; C04B37/025; C04B41/00; C04B41/0036; C04B41/009; C04B41/80; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/06; C04B2237/062; C04B2237/064; C04B2237/30; C04B2237/32; C04B2237/36; C04B2237/361; C04B2237/365; C04B2237/366; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/54; C04B2237/70; C04B2237/704; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/38; H05K3/381
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
EP0170012A2
Cited
EP0233146A1
Cited
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