Patent EP0572232A2 successfully refreshed from Google Patents.
EP0572232A2
Expired / Lapsed
EP
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A multilayer printed circuit board and method for manufacturing same
Assignee: Nippon CMK Corp
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Filing: 1993-05-26
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Granted: —
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Expires: 2013-05-26
Abstract
Abstract A multilayer printed circuit board in which connection holes formed in an inner substrate (1) are filled with conductive paste (22) and the conductive paste is sealed by means of a plated layer (23). After lamination of the inner substrate (1) and outer substrates (2, 3), these connection holes are filled with the conductive paste. Then, the conductive paste is covered and sealed with the plated layer (23). Thus, lands and circuit may be formed in the plated layer (23) corresponding to the connection holes by means of etching.
Inventors
- 👤 Masuo Matsumoto
- 👤 Fusao Birukawa
- 👤 Takazo Takahashi
- 👤 Junzaburo Shirai
- 👤 Mikiya Kojima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 01:04
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/46; H05K3/4602; H05K3/4644; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K2203/06; H05K2203/063; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/4652
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
42 words
A multilayer printed circuit board comprising: at least two printed circuit boards having a connection hole, said printed circuit boards being laminated with each other, said connection hole being filled with conductive paste, said conductive paste being sealed with a plated layer.
Claim 2
Dependent Claim
38 words
A multilayer printed circuit board as claimed in claim 1, wherein the diameter of the connection hole in one of said printed circuit boards is larger than that of the connection hole in the other printed circuit board.
Claim 3
Dependent Claim
20 words
A multilayer printed circuit board as claimed in claim 1, wherein said plated layer forms a part of the circuit.
Claim 4
Dependent Claim
22 words
A multilayer printed circuit board as claimed in claim 1, wherein said plated layer forms a mounting land for an electronic component.
Claim 5
Independent Claim
76 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of: (a) laminating at least two substrates as the first substrate and the second substrate; (b) forming a connection hole penetrating both the first substrate and the second substrate and forming a connection hole penetrating not both the first substrate and the second substrate; (c) filling said connection holes with conductive paste; and (d) forming a plated layer on said conductive paste.
Claim 6
Independent Claim
103 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of: (a) forming a connection hole in a first substrate; (b) filling said connection hole with conductive paste; (c) sealing said conductive paste by a plated layer; (d) forming a connection hole at least in one substrate forming a second substrate; (e) laminating said second substrate with said first substrate; (f) filling said connection hole in said second substrate with conductive paste and filling said connection hole corresponding to both said first substrate and second substrate with conductive paste; and (g) sealing said conductive paste by a plated layer.
Claim 7
Independent Claim
103 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of: (a) forming a connection hole in a first substrate; (b) filling said connection hole with conductive paste; (c) sealing said conductive paste by a plated layer; (d) laminating at least one substrate forming a second substrate with said first substrate; (e) forming a connection hole in said second substrate; (f) filling said connection hole in said second substrate with conductive paste and filling said connection hole corresponding to both said first substrate and second substrate with conductive paste; and (g) sealing said conductive paste by a plated layer.
Claim 8
Independent Claim
44 words
A method of manufacturing a multilayer printed circuit board as claimed in any one of claims 5, 6 or 7, wherein the diameter of the connection hole in one of said substrates is larger than that of the connection hole in the other substrate.
Claim 9
Independent Claim
41 words
A method of manufacturing a multilayer printed circuit board a claimed in any one of claims 5, 6 or 7, wherein said conductive paste is polished to have the same flat surface to the substrate face as before the plating step.
Claim 10
Independent Claim
27 words
A method of manufacturing a multilayer printed circuit board as claimed in any one of claims 5, 6 or 7, wherein said plated layer forms the circuit.
Claim 11
Independent Claim
32 words
A method of manufacturing a multilayer printed circuit board as claimed in any one of claims 5, 6 or 7, wherein said plated layer forms a mounting land for an electronic component.
References Cited (Backward Citations)
No citation records indexed.
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