Patent EP0568930A2 successfully refreshed from Google Patents.
EP0568930A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of manufacturing organic substrate used for printed circuits
Assignee: Panasonic Holdings Corp
•
Filing: 1993-04-30
•
Granted: —
•
Expires: 2013-04-30
Abstract
Abstract A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the free tackness films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the free tackness films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste (4) are connected for electrical connection between the metal foils (5).
Inventors
- 👤 Akihito Hatakeyama
- 👤 Hiroshi Sogo
- 👤 Tamao Kojima
- 👤 Yasuhiko Horio
- 👤 Masahide Tsukamoto
- 👤 Yasushi Fukumura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 17:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0269; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/01; H05K2203/0191; H05K2203/14; H05K2203/1461; H05K3/22; H05K3/28; H05K3/4623; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249953; Y10T428/249994; Y10T428/249995; Y10T428/249996
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
106 words
A method of manufacturing an organic substrate used for printed circuits, which comprises the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into said through-holes (3), separating the free tackness films (1) from said porous raw material (2) filled with the electro-conductive paste (4) in the through-holes (3) thereof, applying metal foils (5) onto the surfaces of said porous raw material (2) from which said free tackness films (1) have been separated, and compressing said porous raw material (2) applied with said metal foils (5) through heating and pressurization.
Claim 2
Independent Claim
139 words
A method of manufacturing an organic substrate used for printed circuits, which comprises the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into said through-holes (3), and also increasing composition ratio of the electro-conductive material with respect to a binder in the electro-conductive paste (4), separating the free tackness films (1) from said porous raw material (2) filled with the electro-conductive paste (4) in the through-holes (3) thereof, applying metal foils (5) onto the surface of said porous raw material (2) from which said free tackness films (1) have been separated, and compressing said porous raw material (2) applied with said metal foils (5) through heating and pressurization so as to make more compact, the electro-conductive material in said electro-conductive paste (4).
Claim 3
Dependent Claim
34 words
A method as claimed in Claim 1 or 2, wherein the step of compressing the porous raw material (2) through heating and pressurization, the compressibility therefor is in the range of 10 to 60%.
Claim 4
Dependent Claim
46 words
A method as claimed in Claim 1 or 2, wherein, before the step for filling the electro-conductive paste (4) into the through-holes (3), another step of preliminarily compressing the porous raw material (2) provided with the free tackness films (1) and having compressive shrinkage is added.
Claim 5
Dependent Claim
50 words
A method as claimed in Claim 1 or 2, wherein said porous raw material (2) provided with the free tackness films (1) and having compressive shrinkage is mainly composed of an organic material, with a porosity of said porous raw material (2) being in the range of 10 to 60%.
Claim 6
Dependent Claim
45 words
A method as claimed in Claim 1 or 2, wherein the porous raw material (2) provided with the free tackness films (1) and having the compressive shrinkage is of a composite material of a non-wofen fabric made of aromatic polyamide fibers and a thermo-setting resin.
Claim 7
Dependent Claim
39 words
A-method as claimed in Claim 1 or 2, wherein the electro-conductive substrate within the electro-conductive paste (4) is a substance selected from the group consisting of sliver, gold, silver palladium, copper, and more than one kind of alloys thereof.
Claim 8
Dependent Claim
64 words
A method as claimed in Claim 1 or 2, wherein the step of compressing the porous raw material 2 applied with the metal foils (5a, 5b) on its opposite surfaces through heating and pressurization further includes a first step for increasing viscosity of the electro-conductive paste (4), and a second step of bonding said metal foils (5a, 5b) to said porous raw material (2).
Claim 9
Dependent Claim
33 words
A method as claimed in Claim 1 or 2, wherein a gel point of the electro-conductive paste (4) is lower than a softening temperature of a resin constituting the porous raw material (2).
Claim 10
Independent Claim
160 words
A method of manufacturing a multi-layered circuit board which comprises the steps of: producing circuit boards each by forming circuit patterns on opposite surfaces of an organic substrate used for printed circuits obtained by the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into said through-holes (3), separating the free tackness films (1) from said porous raw material (2) filled with the electro-conductive paste (4) in the through-holes (3) thereof, applying metal foils (5) onto the surfaces of said porous raw material (2) from which said cover films, porous raw material (2) applied with said metal foils (5) through heating and pressurization. producing an intermediate connecting member by forming through-holes in the porous raw material and filling electro-conductive paste into said through-holes, and holding said intermediate connecting member between at least one pair of said circuit boards for subsequent heating and pressurization thereof.
Claim 11
Independent Claim
206 words
A method of manufacturing a multi-layered circuit board which comprises the steps of: producing circuit boards each by forming printed patterns on opposite surfaces of an organic substrate used for printed circuits obtained by the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into said through-holes (3), and also increasing composition ratio of the electro-conductive substances to a binder in said paste (4), separating the free tackness films (1) from said porous raw material (2) filled with the electro-conductive paste (4) in the through-holes (3) thereof, applying metal foils (5) onto the surfaces of said porous raw material (2) from which said free tackness film (1) have been separated, and compressing said porous raw material (2) applied with said metal foils (5) through heating sand pressurisation so as to make more compact, the electro-conductive material in said electro-conductive paste (4), producing an intermediate connecting member by forming through-holes in the porous raw material and filling electro-conductive paste into said through-holes, applying said intermediate connecting member on said circuit board, and heating and pressurizing after applying other metal foils thereon, and forming circuit patterns by processing said other metal foils.
Claim 12
Dependent Claim
83 words
An organic substrate used for printed circuits, which comprises a porous raw material (2), electro-conductive paste (4) filled in through-holes (3) formed in said porous raw material (2), and metal foils applied onto opposite surfaces of said porous raw material (2), said metal foils (5) stuck to the opposite surfaces of said porous raw material (2) being electrically connected to each other through the electro-conductive paste by compressing said porous raw material (2) applied with said metal foils (5) through heating and pressurization.
Claim 13
Dependent Claim
98 words
An organic substrate used for printed circuits, which comprises a porous raw material (2), electro-conductive paste (4) filled in through-holes (3) formed in said porous raw material (2) and increased in a composition ratio of electro-conductive substances to a binder in said paste, and metal foils applied onto opposite surfaces of said porous raw material (2), said metal foils (5) stuck to the opposite surfaces of said porous raw material (2) being electrically connected to each other through the electro-conductive paste by compressing said porous raw material (2) applied with said metal foils (5) through heating and pressurization.
Claim 14
Dependent Claim
32 words
An organic substrate as claimed in Claim 12 or 13, wherein said porous raw material (2) is one compressed through heating and pressurization at compressibility in the range of 10 to 60%.
Claim 15
Dependent Claim
30 words
An organic substrate as claimed in Claim 12 or 13, wherein said porous raw material (2) is one preliminarily compressed before filling the electro-conductive paste (4) into said through-holes (3).
Claim 16
Dependent Claim
34 words
An organic substrate as claimed in Claim 12 or 13, wherein said porous raw material (2) is mainly composed of an organic material, and has a porosity in the range of 10 to 60%.
Claim 17
Dependent Claim
34 words
An organic substrate as claimed in Claim 12 or 13, wherein said porous raw material (2) is of a composite material of a non-wofen fabric made of aromatic polyamide fibers and a thermo-setting resin.
Claim 18
Dependent Claim
41 words
An organic substrate as claimed in Claim 12 or 13, wherein the electro-conductive substance in the electro-conductive paste (4) is a substance selected from the group consisting of silver, gold, silver palladium, copper and more than one kind of alloys thereof.
Claim 19
Dependent Claim
49 words
An organic substrate as claimed in Claim 12 or 13, wherein the porous raw material (2) is one heated and pressurized in a first step for increasing viscosity of the electro-conductive paste (4), and a second step for bonding the metal foils (5) to said porous raw material (2).
Claim 20
Dependent Claim
33 words
An organic substrate as claimed in Claim 12 or 13, wherein the electro-conductive paste (4) has a gel point lower than a softening temperature of the resin constituting said porous raw material (2).
Claim 21
Dependent Claim
90 words
A multi-layered circuit board which comprises at least a pair of circuit substrates each including circuit patterns formed on opposite surfaces of the organic substrate for the printed circuits as claimed in Claim 12 or 13, and an intermediate connecting member including electro-conductive paste filled in through-holes formed in a porous raw material, said intermediate connecting member being held between said circuit substrates, whereby circuit patterns of said confronting circuit substrates being electrically connected to each other through the electro-conductive paste of said intermediate connecting member by heating and pressurization.
Claim 22
Dependent Claim
104 words
A multi-layered circuit board which comprises circuit substrates each including circuit patterns formed on opposite surfaces of the organic substrate for the printed circuits as claimed in Claim 12 or 13, an intermediate connecting member including electro-conductive paste filled in through-holes formed in a porous raw material, and stuck onto said circuit substrate, and metal foils applied on said intermediate connecting member, and formed with circuit patterns after compression through heating and pressurization, said circuit patterns of said circuit substrates and said circuit patterns of said intermediate connecting member being electrically connected to each other through the electro-conductive paste of said intermediate connecting member.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.